IP Library Granted Patent US 7,287,878
Granted Patent B2
US 7,287,878 · App. 10/869,305 · Granted Oct 30, 2007

LED sign cover and method of manufacture

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Quick Facts
Patent No.
US 7,287,878
App. No.
10/869,305
Granted
Oct 30, 2007
Kind
B2
Abstract

A cover for a LED sign is manufactured from a stainless steel sheet that is dimensionally larger than the array of light emitting diodes comprising the LED sign. The stainless steel sheet is laser cut and then bent to simultaneously form a plurality of apertures and a corresponding plurality of louvers each extending adjacent one of the apertures. The apertures facilitate viewing of the LED sign and the louvers shield the light emitting diodes comprising the LED sign from excessive light.

Claims (26)

1. A LED sign for urban transit vehicles comprising

a substantially vertical array of light emitting diodes;

a cover overlying the entirety of the substantially vertical array of light emitting diodes, the cover comprising a substantially flat sheet formed from stainless steel which defines a predetermined plane;

a plurality of louvers for shielding the light emitting diodes from excessive light, each of the louvers comprising a portion of the stainless steel sheet that is integrally connected to the stainless steel sheet, the louvers having a first position wherein the louvers are positioned in a same plane as the plane of the cover and a second position wherein the louvers are bent into a predetermined angle relative to the plane of the cover, wherein once the louvers are moved from the first position to the second position they remain in the second position; and

wherein the cover further defines a plurality of apertures to facilitate viewing of the light emitting diodes therethrough when the plurality of louvers are in the second position, each of the plurality of louvers located within a corresponding aperture when the plurality of louvers are within the first position before moving to the second position, each of the plurality of apertures defined by a space remaining in the cover when a corresponding louver moves from the first position to the second position.

2. The improvement according to claim 1 wherein substantially all of the apertures formed in the cover are substantially identical in size and shape and wherein substantially all of the apertures formed in the cover extend substantially parallel to one another.

3. The improvement according to claim 2 wherein the light emitting diodes comprising the LED signs are arranged in a rectangular array comprising the first relatively long dimension and a second relatively short dimension extending perpendicularly to the first relatively long dimension; and

wherein the apertures formed in the cover extend substantially parallel to the first relatively long dimension characterizing the array of light emitting diodes.

4. A method of manufacturing a cover for a LED sign comprising an array of light emitting diodes characterized by predetermined dimensions including the steps of:

providing a sheet of opaque material which is dimensionally larger than the array of light emitting diodes comprising the LED sign;

forming at least one aperture in the sheet of opaque material to facilitate viewing of the light emitting diodes comprising the LED sign;

the aperture forming step including the step of forming a cut in the sheet of opaque material which comprises a first relatively long cut line and two relatively short second cut lines each extending angularly relative to the first cut line from the opposite ends thereof and

bending the portion of the sheet of opaque material extending between the two second cut lines thereby simultaneously forming the aperture in the sheet of opaque material and a louver substantially equal in size to the aperture and positioned adjacent to the aperture which shields the array of light emitting diodes from excessive light and enables viewing of the light emitting diodes from a position perpendicular to a plane of the sheet of opaque material.

5. The method of according to claim 4 wherein the step of providing a sheet of opaque material is carried out by providing a stainless steel sheet.

6. The method of according to claim 5 wherein the step of forming the first and second cut lines is carried out by laser cutting the stainless steel sheet.

7. The method according to claim 6 wherein the step of forming first and second cut lines is carried out by forming second cut lines at the opposite ends of the first cut line which extend perpendicularly relative to the first cut line.

8. The method according to claim 7 wherein the cutting and bending steps are replicated thereby forming a plurality of apertures of the stainless steel sheet and a plurality of louvers each positioned adjacent one of the apertures.

9. A method of manufacturing a cover for a LED sign comprising an array of light emitting diodes characterized by predetermined dimensions including the steps of:

providing a stainless steel sheet which is dimensionally larger than the array of light emitting diodes comprising the LED sign;

forming a plurality of apertures in the stainless steel sheet to facilitate viewing of the light emitting diodes comprising the LED sign;

the aperture forming step including the steps of forming cuts in the stainless steel sheet each comprising a relatively long first cut line and two relatively short second cut lines each extending angularly relative to the first cut line from the opposite ends thereof; and

bending the portions of the stainless steel sheet extending between the two second cut lines thereby simultaneously forming the apertures in the stainless steel sheet and louvers substantially equal in size to the apertures and positioned adjacent to the apertures which shield the array of light emitting diodes from excessive light and enables viewing of the light emitting diodes from a position perpendicular to a plane of the stainless steel sheet.

10. The method according to claim 9 wherein the steps of forming the first and second cut lines is carried out by laser cutting the stainless steel sheet.

11. The method according to claim 10 wherein the step of forming first and second cut lines is carried out by forming second cut lines at the opposite ends of the first cut lines which extend perpendicularly relative to the first cut lines.

12. The method according to claim 11 wherein the step of forming apertures in the stainless steel sheet is carried out by forming apertures which are substantially identical in size and shape and further characterized by forming apertures in the stainless steel sheet which extend substantially parallel to one another.

13. The method according to claim 12 wherein the light emitting diodes comprising the LED sign are arranged in a rectangular array comprising a first relatively long dimension and a second relatively short dimension extending perpendicularly to the first relatively long dimension and wherein the step of forming apertures in the stainless steel sheet is carried out by forming apertures which extend substantially parallel to the first long dimension characterizing the array of light emitting diodes.

Assignments (20)
RELEASE OF SECURITY INTEREST Recorded Jun 14, 2024
From: HSBC BANK USA, N.A.
To: CLEVER DEVICES LTD.
Reel/Frame 067732/0264 →
RELEASE OF SECURITY INTEREST Recorded Jun 14, 2024
From: HSBC BANK USA, N.A.
To: CLEVER DEVICES LTD.
Reel/Frame 067733/0611 →
PATENT SECURITY AGREEMENT Recorded Aug 10, 2016
From: LUMINATOR HOLDING L.P.
To: ELAVON FINANCIAL SERVICES DAC, U.K. BRANCH AS SECURITY AGENT
Reel/Frame 039644/0123 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 033053/0330 Recorded Aug 10, 2016
From: AMERICAN CAPITAL, LTD.
To: LUMINATOR HOLDING L.P.
Reel/Frame 039646/0118 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL Recorded Aug 10, 2016
From: ANTARES CAPITAL LP, AS US AGENT
To: LUMINATOR HOLDING L.P.
Reel/Frame 039646/0128 →
ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Sep 3, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS RETIRING AGENT
To: ANTARES CAPITAL LP, AS SUCCESSOR AGENT
Reel/Frame 036538/0346 →
SECURITY INTEREST Recorded May 29, 2014
From: LUMINATOR HOLDING L.P.
To: AMERICAN CAPITAL, LTD.
Reel/Frame 033053/0330 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 028712/0586 Recorded May 16, 2014
From: SIEMENS FINANCIAL SERVICES, INC.
To: DRI NEWCO LLC
Reel/Frame 032910/0116 →
SECURITY AGREEMENT Recorded May 1, 2014
From: CLEVER DEVICES LTD.
To: HSBC BANK USA, N.A.
Reel/Frame 032820/0558 →
SECURITY INTEREST Recorded Apr 7, 2014
From: LUMINATOR HOLDING L.P.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS US AGENT
Reel/Frame 032619/0814 →
BANKRUPTCY COURT ORDER RELEASING ALL LIENS, INCLUDING THE SECURITY INTEREST RECORDED AT REEL/FRAME 021172/0786 Recorded Apr 2, 2014
From: BHC INTERIM FUNDING III, L.P.
To: DIGITAL RECORDERS, INC.
Reel/Frame 032642/0207 →
BANKRUPTCY COURT ORDER RELEASING ALL LIENS, INCLUDING THE SECURITY INTEREST RECORDED AT REEL/FRAME 021194/0283 Recorded Apr 2, 2014
From: DRI AGENT INC. (SUCCESSOR BY ASSIGNMENT (SEE R/F 027727/0891) TO PNC BANK, NATIONAL ASSOCIATION)
To: DIGITAL RECORDERS, INC.
Reel/Frame 032590/0835 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2013
From: DRI NEWCO LLC
To: LUMINATOR HOLDING L.P.
Reel/Frame 029889/0775 →
LIEN Recorded Aug 2, 2012
From: DRI NEWCO LLC
To: SIEMENS FINANCIAL SERVICES, INC., AS COLLATERAL AGENT
Reel/Frame 028712/0586 →
ASSIGNMENT OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 17, 2012
From: PNC BANK, NATIONAL ASSOCIATION
To: DRI AGENT INC.
Reel/Frame 027727/0891 →
RELEASE OF SECURITY INTEREST Recorded Jul 11, 2008
From: LAURUS MASTER FUND, LTD.
To: DIGITAL RECORDERS, INC.
Reel/Frame 021217/0383 →
SECURITY AGREEMENT Recorded Jul 7, 2008
From: DIGITAL RECORDERS, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 021194/0283 →
SECURITY AGREEMENT Recorded Jul 1, 2008
From: DIGITAL RECORDERS, INC.
To: BHC INTERIM FUNDING III, L.P.
Reel/Frame 021172/0786 →
SECURITY AGREEMENT Recorded Feb 16, 2007
From: DIGITAL RECORDERS, INC.; DIGITAL AUDIO CORPORATION; TWIN VISION OF NORTH AMERICA, INC.
To: LAURUS MASTER FUND, LTD.
Reel/Frame 018901/0773 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2004
From: MILLER, WILLIAM H.
To: DIGITAL RECORDERS, INC.
Reel/Frame 015063/0008 →