Wire form heat sink retention module
View Patent ↗A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.
1. A system comprising:
a heat sink having:
a bottom surface;
a bottom first end that includes a heat sink impingement shelf, and
a bottom second end that includes a heat sink retention shelf; and
a retention module having:
a retention module first end that includes:
a retention deck, and
a rotatable wire form having multiple loops,
a retention module second end that includes:
a capture shelf,
wherein upon the heat sink retention shelf being aligned under the capture shelf, the rotatable wire form can be rotated, thus causing the multiple loops to force the heat sink impingement shelf against the retention deck surface, thereby resulting in the bottom surface of the heat sink being pressed against a top surface of a computer chip that is oriented beneath the bottom surface of the heat sink.
2. The system of claim 1 , wherein the rotatable wire form has a wire form first loop and a wire form second loop, and wherein the wire form first loop is angularly offset relative to a central axis of the rotatable wire form, such that, when the rotatable wire form is rotated, the wire form first loop makes contact with the heat sink impingement shelf before the wire form second loop makes contact with the heat sink impingement shelf, thereby compensating for a torsion lag between the wire form second loop and the wire form first loop.
3. The system of claim 1 , wherein the heat sink impingement shelf has a top chamfered end, such that when the rotatable wire form presses against the top chamfered end, the heat sink is moved towards the retention module second end.
4. The system of claim 3 , wherein the capture shelf has a bottom chamfered end, such that the movement of the heat sink towards the retention module second end causes the bottom surface of the heat sink to move towards the top surface of the computer chip.
5. The system of claim 1 , further comprising a handle lock stud protruding from a side of the retention module, wherein a handle connected to the rotatable wire form locks under the handle lock stud when the multiple loops press against the heat sink impingement shelf.
6. The system of claim 1 , wherein a thermal grease is oriented between the computer chip and the bottom of the heat sink.
7. The system of claim 6 , wherein the rotatable wire form further comprises a kick out protrusion, such that when the rotatable wire form is counter-rotated, the kick out protrusion engages against the bottom of the heat sink to break a suction force between the computer chip and the heat sink created by the thermal grease.
8. The system of claim 2 , wherein the rotatable wire form further comprises a kick out protrusion, such that when the rotatable wire form is counter-rotated, the kick out protrusion engages against the bottom of the heat sink to push the heat sink away from the computer chip.
9. The system of claim 8 , wherein the kick out protrusion is a bend in an end of the rotatable wire form, the bend being offset 90° from the wire form second loop.