CMP composition for improved oxide removal rate
The invention provides a chemical-mechanical polishing composition that comprises an abrasive, a halide salt, and water. The invention further provides a method for the chemical-mechanical polishing of a substrate with the chemical-mechanical polishing composition and a polishing pad.
1 . A chemical-mechanical polishing composition comprising:
(a) about 0.01 wt. % to about 1 wt. % of an abrasive selected from the group consisting of alumina, ceria, zirconia, and combinations thereof,
(b) about 0.05 mM to about 30 mM of a halide salt comprising an anion selected from the group consisting of Cl − , Br − , and I − , and
(c) water,
wherein the polishing composition has a pH of less than 9.
2 . The chemical-mechanical polishing composition of claim 1 , wherein the polishing composition has a pH of about 3 to about 8.
3 . The chemical-mechanical polishing composition of claim 1 , wherein the abrasive is alumina or ceria.
4 . The chemical-mechanical polishing composition of claim 3 , wherein the abrasive is ceria.
5 . The chemical-mechanical polishing composition of claim 4 , wherein the halide salt comprises the anion I—.
6 . The chemical-mechanical polishing composition of claim 5 , wherein the halide salt comprises a cation selected from the group consisting of Li + , Na + , K + , Mg 2+ , Ca 2+ , Sr 2+ , Ba 2+ , Fe 2+ , NH 4 + , and C 5 H 5 NH + .
7 . The chemical-mechanical polishing composition of claim 6 , wherein the halide salt is KI.
8 . The polishing composition of claim 7 , further comprising an organic carboxylic acid.
9 . The chemical-mechanical polishing composition of claim 1 , wherein the halide salt comprises the anion I − .
10 . The chemical-mechanical polishing composition of claim 1 , wherein the halide salt comprises a cation selected from the group consisting of Li + , Na + , K + , Mg + , Ca 2+ , Sr 2+ , Ba 2+ , Fe 2+ , NH 4 + , and C 5 H 5 NH + .
11 . The chemical-mechanical polishing composition of claim 10 , wherein the halide salt is KI.
12 . The chemical-mechanical polishing composition of claim 1 , wherein the abrasive is present in the amount of about 0.01 wt. % to about 0.5 wt. %.
13 . The chemical-mechanical polishing composition of claim 1 , wherein the halide salt is present in a concentration of about 0.1 mM to about 10 mM.
14 . The chemical-mechanical polishing composition of claim 1 , further comprising an organic carboxylic acid.
15 . The chemical-mechanical polishing composition of claim 14 , wherein the organic carboxylic acid is selected from the group consisting of monocarboxylic acids and dicarboxylic acids.
16 . The chemical-mechanical polishing composition of claim 15 , wherein the organic carboxylic acid is an amino carboxylic acid.
17 . A method of chemical-mechanical polishing comprising:
(i) contacting a substrate with a polishing pad and a chemical-mechanical polishing composition comprising:
(a) about 0.01 wt. % to about 1 wt. % of an abrasive selected from the group consisting of alumina, ceria, zirconia, and combinations thereof,
(b) about 0.05 mM to about 30 mM of a halide salt comprising an anion selected from the group consisting of Cl − , Br − , and I − , and
(c) water,
wherein the polishing composition has a pH of less than 9,
(ii) moving the polishing pad relative to the substrate with the chemical-mechanical polishing composition therebetween, and
(iii) abrading at least a portion of the substrate to polish the substrate.
18 . The method of claim 17 , wherein the chemical-mechanical polishing composition has a pH of about 3 to about 8.
19 . The method of claim 17 , wherein the abrasive is alumina or ceria.
20 . The method of claim 19 , wherein the abrasive is ceria.
21 . The method of claim 20 , wherein the halide salt comprises the anion I − .
22 . The method of claim 21 , wherein the halide salt comprises a cation selected from the group consisting of Li + , Na + , K + , Mg + , Ca 2+ , Sr 2+ , Ba 2+ , Fe 2+ , NH 4 + , and C 5 H 5 NH + .
23 . The method of claim 22 , wherein the halide salt is KI.
24 . The method of claim 23 , further comprising an organic carboxylic acid.
25 . The method of claim 17 , wherein the halide salt comprises the anion I − .
26 . The method of claim 17 , wherein the halide salt comprises a cation selected from the group consisting of Li + , Na + , K + , Mg + , Ca 2+ , Sr 2+ , Ba 2+ , Fe 2+ , NH 4 + and C 5 H 5 NH + .
27 . The method of claim 26 , wherein the halide salt is KI.
28 . The method of claim 17 , wherein the abrasive is present in the amount of from about 0.01 wt. % to about 0.5 wt. %.
29 . The method of claim 17 , wherein the halide salt is present in a concentration of about 0.1 mM to about 10 mM.
30 . The method of claim 17 , further comprising an organic carboxylic acid.
31 . The method of claim 30 , wherein the organic carboxylic acid is selected from the group consisting of monocarboxylic acids and dicarboxylic acids.
32 . The method of claim 31 , wherein the organic carboxylic acid is an amino carboxylic acid.
33 . The method of claim 17 , wherein the substrate comprises silicon dioxide.