EMI absorbing shielding for a printed circuit board

1. An EMI shield comprising:

a shield body comprising a EMI reflecting conductive layer coupled to a polymer substrate;

an EMI absorbing material coupled to the conductive layer of the shield body, the EMI absorbing material, comprising:

a surface resistivity conductive layer that has surface resistivity higher than the conductive layer; and

a metal layer that is disposed on an open-celled skeletal structure.

2. The EMI shield of claim 1 wherein the high surface resistivity conductive layer comprises a surface resistivity between about 50 and about 500 ohms per square and the conductive layer has a surface resistivity between about 0.01 ohms per square and about 3 ohms per square.

3. The EMI shield of claim 1 wherein the metal layer has a thickness between about 1 micron and about 50 microns,

wherein the conductive layer has a thickness between about 0.01 microns and about 0.1 microns.

4. The EMI shield of claim 1 wherein the conductive open-celled skeletal structure comprises a reticulated foam or a carbon loaded reticulated foam.

5. An EMI shield comprising:

a shield body comprising a conductive layer coupled to a polymer substrate, wherein the conductive layer has a sufficient thickness to reflect EMI;

an EMI absorbing material electrically coupled to the conductive layer, wherein the EMI absorbing material comprises a higher permeability and permittivity than the conductive layer; and

a substrate having an open-celled skeletal structure and a conductive metal layer deposited on at least a portion of the open-celled skeletal structure.

6. The EMI shield of claim 5 wherein the conductive open-celled skeletal structure comprises a reticulated foam, said reticulated foam further comprises a metal layer on all interior surfaces and on all exterior surfaces except a lower surface that is configured to be in contact with at least one of a printed circuit board, an electronic component, and traces on the printed circuit board.

7. The EMI shield of claim 6 wherein the reticulated foam comprises a metal layer throughout the open-celled skeletal structure so as to maintain electrical continuity throughout the substrate.

8. The EMI shield of claim 6 wherein the reticulated foam only partially fills the chamber defined by the shield body.

9. The EMI shield of claim 6 where the reticulated foam substantially fully fills the chamber defined by the shield body.

10. The EMI shield of claim 5 wherein the shield body comprises a top surface and a plurality of sidewalls that extend at an angle from the sidewalls so as to define a chamber that receives an electronic component.

11. The EMI shield of claim 5 wherein the shield body comprises an inner layer and an outer layer, wherein the EMI absorbing material is positioned between the inner layer and the outer layer.