Electrostatic capacitive touch pad
View Patent ↗On a surface of a film substrate made of an insulating synthetic resin, which is formed by connecting an approximately quadrangular first film substrate and an approximately quadrangular second film substrate through a bent portion, a ground electrode formed to cover at least a part of the second film substrate, and a first electrode layer formed of one of the wiring patterns on a part of the first film substrate are formed. An insulating film made of an insulating resin is formed on the first electrode layer, a second electrode layer formed of the other of the wiring patterns is formed on a surface corresponding to the part of the first film substrate of the insulating film, and the film substrate, the first electrode layer and the insulating film are bent in the bent portion such that the rear surfaces of the film substrate face each other.
1. An electrostatic capacitive touch pad for detecting an electrostatic capacity and having two types of wiring patterns formed on a substrate,
wherein, on a surface of a film substrate made of an insulating synthetic resin which is formed by connecting an approximately quadrangular first film substrate and an approximately quadrangular second film substrate through a bent portion, a ground electrode layer formed of a shield layer and formed to cover at least a surface portion of the second film substrate, and a first electrode layer formed of a first of the wiring patterns on a part of the first film substrate are formed,
wherein an insulating film made of an insulating resin is formed on the first electrode layer,
wherein a second electrode layer formed of a second of the wiring patterns is formed on a surface corresponding to the part of the first film substrate of the insulating film, and
wherein the film substrate, the first electrode layer, and the insulating film are bent in the bent portion such that rear surfaces of the film substrate face each other.
2. The touch pad according to claim 1 , wherein, on a circumferential portion of the first film substrate, a ground electrode surrounding the first of the wiring patterns is formed, and the ground electrode is electrically connected to the shield layer formed on the second film substrate through the bent portion.
3. The touch pad according to claim 2 , wherein the shield layer is formed on the entire surface part of the second film substrate and a surface of the bent portion.