Boron free joint for superalloy component
View Patent ↗A boron-free and silicon-free bonding alloy ( 16 ) for joining with a superalloy base material ( 12, 14 ). The bonding alloy includes aluminum in a concentration that is higher than the concentration of aluminum in the base material in order to depress the melting temperature for the bonding alloy to facilitate liquid phase diffusion bonding without melting the base material. The concentration of aluminum in the bonding alloy may be at least twice that of the concentration of aluminum in the base material. For joining cobalt-based superalloy materials that do no contain aluminum, the concentration of aluminum in the bonding alloy may be at least 5 wt. %.
1. A joint comprising a superalloy base material metallurgically joined with a bonding alloy, characterized in that the bonding alloy comprises 21 wt. % aluminum, 10 wt. % cobalt, 5 wt. % chrome, 1 wt. % titanium, 0.5 hafnium, and balance nickel, such that a melting point temperature of the bonding alloy is lower than a melting point temperature of the superalloy base material for forming the joint without melting the superalloy base material.
2. A superalloy article comprising:
a substrate material comprising 5.5 wt. % aluminum, 10.0 wt. % cobalt, 9.0 wt. % chrome, 1.5 wt. % hafnium, 2.5 wt. % Ta, 1.5 wt. % titanium, 10.0 wt. % tungsten, 0.015 wt. % zirconium, 0.0 15 % boron, and balance nickel; and
a bonding material joined to the substrate material, the bonding material comprising 21 wt. % aluminum, 10 wt. % cobalt, 5 wt. % chrome, 1 wt. % titanium, 0.5 wt. % hafnium, 0.5 wt. % zirconium, and balance nickel.
3. The joint of claim 1 , wherein the bonding alloy further comprises 0.5 wt. % zirconium.