Polycrystalline liquid crystal display device having large width channel and method of fabricating the same
View Patent ↗A polysilicon liquid crystal display (LCD) device having a large width channel includes a buffer layer formed on a substrate, an active layer formed on the buffer layer and having a plurality of heat releasing parts, a gate line formed in a width direction of the active layer, at least one heat releasing path formed in each of the plurality of heat releasing parts, source and drain electrodes symmetrically formed at both sides of the active layer, and a contact hole connecting the source and drain electrodes and the active layer.
1. A method for fabricating a polysilicon liquid crystal display (LCD) device, comprising:
forming a buffer layer on a substrate;
forming an active layer having at least one opening in the buffer layer for serving as a heat releasing part;
forming a first, insulation layer on the active layer;
forming a gate line on the first insulation layer;
forming a second insulation layer on the gate line;
forming at least one hole as a heat releasing path in an opening of the second insulation layer;
forming at least one contact hole in the second insulation layer;
forming source and drain electrodes connected to the active layer through the contact hole; and
forming a passivation layer in the hole to connect to the buffer layer along the heat releasing path,
wherein forming the heat releasing path and the contact hole in the second insulation layer comprises:
forming a photoresist film on the second insulation layer;
forming a heat-releasing-path forming region by partially removing the photoresist film to expose the second insulation layer;
forming a contact-hole forming region by diffraction-exposing the photoresist film;
removing the exposed second insulation layer and the diffraction-exposed photoresist film; and
removing portions of the buffer layer and the first insulation layer that correspond to the heat-releasing-path forming region.
2. The method of claim 1 , wherein the exposed second insulation layer and the diffraction-exposed photoresist film are removed through dry etching.
3. The method of claim 1 , wherein removing portions of the buffer layer and the first insulation layer is performed at the same time as removing portions of the first insulation layer and the second insulation layer, which corresponding to the contact-hole forming region, to expose the active layer.
4. The method of claim 1 , wherein the portions of the buffer layer and the first insulation layer that correspond to the heat-releasing-path forming region are removed through wet etching.
5. The method of claim 1 , wherein forming a heat-releasing path forming region and forming a contact hole forming region are formed simultaneously by diffraction exposing method using mask including patter for full exposure and pattern for diffraction exposure.
6. The method of claim 1 , wherein removing portions of the buffer layer is performed by removing silicon oxide layer of the buffer layer.
7. A method for fabricating a polysilicon LCD device, comprising:
forming a buffer layer on a substrate;
forming an active layer having at least one heat releasing part on the buffer layer;
forming a first insulation layer on the active layer;
forming a gate line on the first insulation layer;
forming a second insulation layer on the gate line;
forming a photoresist film on the second insulation layer;
forming a heat-releasing-path forming region by partially removing the photoresist film to expose the second insulation layer;
forming a contact-hole forming regions by diffraction-exposing the photoresist film;
removing the exposed second insulation layer and the diffraction-exposed photoresist film to form contact holes;
removing portions of the buffer layer and the first insulation layer that correspond to the heat-releasing-path forming region; and
forming source and drain electrodes connected to the active layer through the contact holes.
8. The method of claim 7 , wherein the exposed second insulation layer and the diffraction-exposed photoresist film are removed through dry etching.
9. The method of claim 7 , wherein removing portions of the buffer layer and the first insulation layer is performed at the same time as removing portions of the first insulation layer and the second insulation layer, which corresponding to the contact-hole forming region, to expose the active layer.
10. The method of claim 7 , wherein the portions of the buffer layer and the first insulation layer that correspond to the heat-releasing-path forming region are removed through wet etching.
11. The method of claim 7 , wherein forming a heat-releasing-path forming region and forming a contact hole forming region are formed simultaneously by diffraction exposing method using mask including patter for full exposure and pattern for diffraction exposure.
12. The method of claim 7 , wherein removing portions of the buffer layer is performed by removing silicon oxide layer of the buffer layer.