IP Library Granted Patent US 7,259,807
Granted Patent B2
US 7,259,807 · App. 10/877,590 · Granted Aug 21, 2007

Method of manufacturing thin film transistor array panel and liquid crystal display

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Quick Facts
Patent No.
US 7,259,807
App. No.
10/877,590
Granted
Aug 21, 2007
Kind
B2
Abstract

A method of manufacturing a thin film transistor array panel is provided, which includes: forming a gate line including a gate electrode on a substrate; depositing a gate insulating layer; forming a semiconductor layer on the gate insulating layer; forming an ohmic contact layer on the semiconductor layer; forming a data line including a source electrode and a drain electrode on the ohmic contact layer at least in part; forming an alignment key including the same layer as the data line; coating a first photosensitive film for a color filter; aligning a mask for color filter with the substrate provided with the first photosensitive film using the alignment key; forming a first color filter by light exposure and developing the first photosensitive film; and forming a pixel electrode connected to the drain electrode.

Claims (76)

1. A method for manufacturing a thin film transistor array panel, the method comprising:

forming a gate line including a gate electrode on a substrate;

depositing a gate insulating layer;

forming a semiconductor layer on the gate insulating layer;

forming an ohmic contact layer on the semiconductor layer;

forming a data line including a source electrode and a drain electrode on the ohmic contact layer at least in part;

forming an alignment key in the same layer as the data line;

coating a first photosensitive film for a color filter;

aligning a mask for color filter with the substrate provided with the first photosensitive film using the alignment key;

forming a first color filter by light exposure and developing the first photosensitive film; and,

forming a pixel electrode connected to the drain electrode,

wherein the semiconductor layer, the ohmic contact layer, the data line, and the drain electrode are formed by a single photolithography step.

2. The method of claim 1 , further comprising:

forming a passivation layer under the pixel electrode.

3. The method of claim 2 , wherein the passivation layer is disposed on or under the color filter.

4. The method of claim 3 , wherein the passivation layer includes silicon nitride or silicon oxide.

5. The method of claim 3 , wherein the passivation layer includes organic insulator.

6. The method of claim 1 , further comprising:

coating a second photosensitive film for a color filter;

aligning the mask for color filter with the substrate provided with the second photosensitive film using the alignment key;

forming a second color filter by light exposure and developing the first photosensitive film;

coating a third photosensitive film for a color filter;

aligning the mask for color filter with the substrate provided with the third photosensitive film using the alignment key; and,

forming a third color filter by light exposure and developing the first photosensitive film,

wherein the first to the third color filters represent red, green, and blue colors.

7. The method of claim 6 , wherein adjacent two of the first to the third color filters overlap each other in part.

8. A thin film transistor array panel, comprising:

a gate line including a gate electrode formed on a substrate;

a gate insulating layer deposited on the gate electrode;

a semiconductor layer formed on the gate insulating layer;

an ohmic contact layer formed on the semiconductor layer;

a data line including a source electrode and a drain electrode formed at least in part on the ohmic contact layer;

an alignment key formed in the same layer as the data line;

a first color filter formed on and aligned with the substrate using the alignment key; and,

a pixel electrode connected to the drain electrode,

wherein the first color filter is formed so as to partially overlap or to be partially overlapped by at least one adjacent color filter.

9. The panel of claim 8 , further comprising:

a passivation layer formed under the pixel electrode.

10. The panel of claim 9 , wherein the passivation layer is disposed above or below the first color filter.

11. The panel of claim 10 , wherein the passivation layer comprises silicon nitride or silicon oxide.

12. The panel of claim 10 , wherein the passivation layer comprises an organic insulator.

13. The panel of claim 8 , further comprising:

second and third color filters formed on and aligned with the substrate using the alignment key, and

wherein the first to the third color filters represent red, green, and blue colors.

14. The panel of claim 13 , wherein adjacent pairs of the first, second and third color filters partially overlap each other.

15. The panel of claim 8 , wherein the semiconductor layer, the ohmic contact layer, the data line, and the drain electrode are formed by a single photolithography step.

16. A method for manufacturing a thin film transistor array panel, the method comprising:

forming a gate line including a gate electrode on a substrate;

depositing a gate insulating layer;

forming a semiconductor layer on the gate insulating layer;

forming an ohmic contact layer on the semiconductor layer;

forming a data line including a source electrode and a drain electrode on the ohmic contact layer at least in part;

forming an alignment key in the same layer as the data line;

coating a first photosensitive film for a color filter;

providing a mask for making a color filter from the first photosensitive film;

aligning the mask with the substrate using the alignment key;

forming a first color filter by light exposure and developing the first photosensitive film; and,

forming a pixel electrode connected to the drain electrode,

wherein the first color filter is formed so as to partially overlap or to be partially overlapped by at least one adjacent color filter.

17. The method of claim 16 , further comprising:

forming a passivation layer under the pixel electrode.

18. The method of claim 17 , wherein the passivation layer is disposed on or under the color filter.

19. The method of claim 18 , wherein the passivation layer includes silicon nitride or silicon oxide.

20. The method of claim 18 , wherein the passivation layer includes an organic insulator.

21. The method of claim 16 , further comprising:

coating a second photosensitive film for a second color filter;

aligning the mask for color filter with the substrate provided with the second photosensitive film using the alignment key;

forming a second color filter by light exposure and developing the first photosensitive film;

coating a third photosensitive film for a color filter;

aligning the mask for color filter with the substrate provided with the third photosensitive film using the alignment key; and,

forming a third color filter by light exposure and developing the first photosensitive film,

wherein the first to the third color filters represent red, green, and blue colors.

22. The method of claim 21 , wherein adjacent two of the first to the third color filters overlap each other in part.

23. The method of claim 16 , wherein the semiconductor layer, the ohmic contact layer, the data line, and the drain electrode are formed by a single photolithography step.

24. A thin film transistor array panel manufactured in accordance with the method of claim 1 .

25. A thin film transistor array panel manufactured in accordance with the method of claim 16 .

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2026
From: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: LONESTAR CRYSTAL DISPLAY LLC
Reel/Frame 074944/0730 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: SAMSUNG DISPLAY CO., LTD.
To: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 060778/0432 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029015/0862 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTOR'S NAME TO READ "KIM, DONG-GYU" PREVIOUSLY RECORDED ON REEL 015525 FRAME 0227. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT ASSIGNMENT. Recorded Jan 17, 2006
From: KIM, DONG-GYU
To: SAMSUNG ELECTRONICS CO. LTD.
Reel/Frame 017022/0035 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2004
From: KIM, DONG-DYU
To: SAMSUNG ELECTRONICS CO. LTD.
Reel/Frame 015525/0227 →