Inkjet printhead nozzle plate
View Patent ↗Methods of forming a nozzle plate include forming a first reverse imageable positive photoresist layer on the substrate and protecting an area thereof adjacent an ink ejection element from ultraviolet energy while exposing other than the protected area to such energy. Thereafter, the non-protected area is rendered insoluble by heating. Thereafter, the protected area is exposed to ultraviolet energy to weaken its structure for later removal. A second reverse imageable positive resist layer gets formed on the first layer and exposed to ultraviolet energy in a region directly above the ink ejection element. In a single step, both the protected area of the first layer and the non-protected region of the second layer are removed to form an ink flow feature, a bubble chamber or an orifice of the nozzle plate. The remainders of the first and second layers become blanket exposed to ultraviolet energy and cured in place.
1. An inkjet printhead, comprising:
a body; and
a substrate with an ink ejection element bonded to said body having a nozzle plate formed concurrently therewith, said nozzle plate having two reverse imageable positive resist layers cured together defining a thickness thereof and being one of laminated and spin casted on a surface of said substrate, one of said two layers defining a nozzle orifice and another of said two layers defining one of a bubble chamber and an ink flow feature.
2. An inkjet printhead, comprising:
a body; and
a substrate with an ink ejection element bonded to said body having a nozzle plate formed concurrently therewith, said nozzle plate having two reverse imageable positive resist layers cured together defining a thickness thereof, one of said two layers defining a nozzle orifice and another of said two layers defining one of a bubble chamber and an ink flow feature.
3. The printhead of claim 2 , wherein said ink ejection element includes a resistor layer on said substrate having a composition of tantalum, aluminum and nitrogen.
4. The printhead of claim 2 , wherein said thickness is about 28 to about 32 microns.
5. The printhead of claim 2 , wherein said nozzle orifice is aligned with said ink ejection element in a direction away from said substrate.
6. The printhead of claim 2 , wherein said bubble chamber is above said ink ejection element in a direction away from said substrate.
7. The printhead of claim 2 , wherein said ink flow feature is above said ink ejection element in a direction away from said substrate.
8. An inkjet printhead, comprising:
a substrate with a plurality of ink ejection elements formed thereon; and
two reverse imageable positive resist layers cured together on said substrate to define a nozzle plate thickness, an outermost layer of said two layers defining a nozzle orifice for each said plurality of ink ejection elements and an innermost layer of said two layers defining one of a bubble chamber and an ink flow feature for said each said plurality of ink ejection elements.
9. The inkjet printhead of claim 8 , wherein said outermost layer has a thickness of about 14 to about 16 microns.
10. The inkjet printhead of claim 8 , wherein said innermost layer has a thickness of about 14 to about 16 microns.
11. The inkjet printhead of claim 8 , wherein said nozzle plate thickness is about 28 to about 32 microns.
12. The inkjet printhead of claim 8 , wherein said innermost and outermost layers are able to withstand heating at temperatures in a range of about 100 to about 225 degrees Celsius.
13. The inkjet printhead of claim 8 , wherein said innermost and outermost layers are able to withstand UV radiation at I-line frequencies.
14. The inkjet printhead of claim 8 , wherein one of said innermost and outermost layers originally comprise a solution of positive resist material.
15. The inkjet printhead of claim 8 , wherein one of said innermost and outermost layers originally comprise a dry film of positive resist material.
16. The inkjet printhead of claim 8 , wherein said each said plurality of ink ejection elements includes a resistor layer of tantalum, aluminum and nitrogen composition.
17. The inkjet printhead of claim 16 , wherein said resistor layer is about 900 to about 1000 angstroms.
18. The inkjet printhead of claim 8 , further including a body to which said substrate is bonded.
19. The inkjet printhead of claim 18 , further include a TAB circuit attached to both said body and said substrate.
20. The inkjet printhead of claim 8 , wherein each said nozzle orifice is aligned with one of said plurality of ink ejection elements in a direction away from said substrate.