Piezoelectric ink jet printing module

1. An ink jet module comprising a piezoelectric element having a semiconductive material in contact with a surface of the piezoelectric element, wherein the semiconductive material bleeds pyroelectric charge from the piezoelectric element.

2. The ink jet module of claim 1 , wherein the semiconductive material has a resistivity of 5000 megaohms per square or less.

3. The ink jet module of claim 1 , wherein the semiconductive material has a resistivity of 0.1 megaohms per square or greater.

4. The ink jet module of claim 1 , wherein the semiconductive material has a diffusivity of between 0.006 and 100 cm 2 /sec.

5. The ink jet module of claim 1 , wherein the semiconductive material includes a doped insulator.

6. The ink jet module of claim 1 , wherein the semiconductive material is derived from alumina, silicon nitride, or neodymium oxide.

7. The ink jet module of claim 1 , wherein the semiconductive material is derived from silicon nitride.

8. The ink jet module of claim 1 , wherein the semiconductive material is a coating between 1000 and 10000 Angstroms thick.

9. The ink jet module of claim 1 , wherein the piezoelectric element is lead zirconium titanate.

10. The ink jet module of claim 1 , wherein the module is subjected to heating and cooling cycles.

11. The ink jet module of claim 10 , further comprising a series of channels.

12. The ink jet module of claim 1 , further comprising an ink channel, the piezoelectric element being positioned to subject ink within the channel to jetting pressure, and electrical contacts arranged for activation of the piezoelectric element.

13. The ink jet module of claim 12 , wherein each of said channels is covered by a single piezoelectric element.

14. An ink jet print head comprising a plurality of ink jet modules including the ink jet module of claim 1 .

15. The ink jet module of claim 1 , wherein the semiconductive material is a coating on the surface of the piezoelectric element.