Thermal flow sensor having an inverted substrate
A thermal flow sensor has a first substrate, second substrate and a third substrate, each of which has a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit.
1. A thermal flow sensor comprising:
a first substrate having a first side and a second opposite side;
a second substrate having a first side and a second opposite side, said first substrate being connected to said second substrate such that said second side of said first substrate abuts said first side of said second substrate;
a third substrate having a first side and a second opposite side, said third substrate being connected to said second substrate such that said second side of said second substrate abuts said first side of said third substrate;
wherein said second substrate having a cutout formed therein so as to form a conduit bounded by said second substrate and said second side of said first substrate and said first side of said third substrate,
a heater disposed on said first side of said first substrate opposed to said conduit; and
a first temperature sensor disposed on said first side of said first substrate opposed to said conduit.
2. The thermal flow sensor according to claim 1 , further comprising a second temperature sensor disposed on said first side of said first substrate opposed to said conduit.
3. The thermal flow sensor according to claim 2 , further comprising a cap mounted on said first side of said first substrate thereby forming an interior chamber, said heater, said first temperature sensor and said second temperature sensor being disposed within said interior chamber.
4. The thermal flow sensor according to claim 3 , wherein said cap is brazed to said first substrate thereby forming a sealed interior chamber.
5. The thermal flow sensor according to claim 4 , further comprising electronics within said chamber and electrically connected to said heater, said first temperature sensor and said second temperature sensor to permit said electronics to communicate by telemetry to a control unit.
6. The thermal flow sensor according to claim 1 , wherein said first and third substrates are made of borosilicate glass.
7. The thermal flow sensor according to claim 6 , wherein said second substrate is made of silicon.
8. The thermal flow sensor according to claim 1 , wherein said first substrate is bonded to said second substrate and said second substrate is bonded to said third substrate.