IP Library Granted Patent US 7,267,431
Granted Patent B2
US 7,267,431 · App. 10/881,961 · Granted Sep 11, 2007

Multi-fluid ejection device

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Quick Facts
Patent No.
US 7,267,431
App. No.
10/881,961
Granted
Sep 11, 2007
Kind
B2
Abstract

A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.

Claims (22)

1. A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom, the multi-fluid body comprising:

at least two segregated fluid chambers; and

independent fluid supply paths from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate, the ejection head substrate being attached adjacent an ejection head area of the body, wherein the fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow path per millimeter in the substrate.

2. The multi-fluid body and ejection head substrate of claim 1 , wherein fluid supply paths corresponding to the fluid flow paths are partially molded and partially micro-machined in a bottom portion of the body for independent fluid flow from each of the chambers to the ejection head substrate.

3. The multi-fluid body and ejection head substrate of claim 1 , further comprising a manifold structure disposed between a bottom portion of the body and the ejection head substrate, the manifold containing fluid flow channels therein for fluid flow from the fluid supply paths of the body to the fluid flow paths of the substrate.

4. The multi-fluid body and ejection head substrate of claim 3 , wherein the manifold comprises a ceramic manifold.

5. The multi-fluid body and ejection head substrate of claim 4 , wherein the ceramic manifold comprises a multi-layer ceramic structure having tortuous fluid channels therethrough.

6. The multi-fluid body and ejection head substrate of claim 3 , wherein the manifold comprises a polymeric manifold containing fluid flow channels at least partially molded therein.

7. The multi-fluid body and ejection head substrate of claim 3 , wherein the fluid flow channels in the manifold are angled through the manifold to provide a channel spacing on a first side of the manifold that is less than a channel spacing on a second side of the manifold.

8. The multi-fluid body and ejection head substrate of claim 3 , wherein the manifold comprises a block having a trapezoidal profile with at least one fluid flow channel formed in an angled wall surface thereof.

9. The multi-fluid body and ejection head substrate of claim 3 , wherein the manifold includes non-symmetrical fluid flow channels each having a wide end having an opening extending through a thickness of the manifold and a narrow end extending part way through the thickness of the manifold.

10. The multi-fluid body and ejection head substrate of claim 1 , wherein the ejection head substrate has a fluid flow path density ranging from about 1.0 to about 3.0 fluid flow paths per millimeter.

11. The multi-fluid body and ejection head substrate of claim 1 , wherein the body comprises at least three segregated fluid chambers for ejecting three different fluids onto a medium.

12. The multi-fluid body and ejection head substrate of claim 1 , wherein the fluid supply paths are injection-molded in the multi-fluid body to provide a fluid supply path density ranging from about 1.0 to about 3.0 fluid supply paths per millimeter.

13. The multi-fluid body and ejection head substrate of claim 1 , wherein the fluid supply paths in the body have a stepped opening width.

14. The multi-fluid body and ejection head substrate of claim 1 , wherein the substrate contains fluid flow paths therein having an elongate trench on a first side of the substrate in fluid flow communication with a non-elongate opening on a second side of the substrate.

15. The multi-fluid body and ejection head substrate of claim 14 , wherein the fluid flow paths are etched in the substrate using a deep reactive ion etching (DRIE) process.

16. The multi-fluid body and ejection head substrate of claim 14 , wherein at least one of the fluid flow paths contains a non-elongate opening that is staggered with respect to another non-elongate opening for another one of the fluid flow paths.

17. The multi-fluid body and ejection head substrate of claim 1 , wherein the substrate contains fluid flow paths angled through a thickness of the substrate so that fluid flow path openings on a first side of the substrate adjacent the body have a greater spacing of fluid flow path openings on a second side of the substrate.

18. The multi-fluid body and ejection head substrate of claim 1 , wherein the substrate has a substrate thickness and contains etched fluid flow paths therein wherein each fluid flow path has a first trench on a first side of the substrate and a second trench on a second side of the substrate in fluid flow communication with the first trench, wherein the first and second trenches are offset from each other, and wherein the first and second trenches are partially etched through the thickness of the substrate.

19. The multi-fluid body and ejection head substrate of claim 1 , wherein at least two of the fluid supply paths in the body are disposed to provide fluid to a single one of the fluid flow paths in the substrate.

20. An ink jet printer comprising the multi-fluid body and ejection head substrate of claim 1 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2004
From: ANDERSON, FRANK EDWARD; BUCHANAN, JEFFERY JAMES; DROEGE, CURTIS RAY; GREER, DAVID EMERSON; LONG, GREGORY ALAN; SPIVEY, PAUL TIMOTHY; KWAN, KIN MING; PHATAK, GANESH VINAYAK; SULLIVAN, CARL EDMOND; UBELLACKER, KENT LEE; WALDECK, MELISSA MARIE
To: LEXMARK INTERNATIONAL, INC.
Reel/Frame 015538/0652 →