IP Library Granted Patent US 7,040,736
Granted Patent B2
US 7,040,736 · App. 10/882,764 · Granted May 9, 2006

Modular printhead assembly with thermal expansion compensation

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,040,736
App. No.
10/882,764
Granted
May 9, 2006
Kind
B2
Abstract

A printhead assembly with an elongate support member and two or more printhead modules detachably mounted in series along the support member, the support member having a structural component for strengthening the member, and a mounting component for mounting the printhead modules; wherein, the mounting component is connected to the structural component to allow relative thermal expansion. By allowing the structural component of the support to thermally expand relative to the mounting component, the structural components can be strong, inexpensive metal despite the co-efficient of thermal expansion (CTE). Only the mounting component need approximate the CTE of the printhead chips to maintain a suitable alignment of the modules.

Claims (9)

1. A printhead assembly for an inkjet printer, the assembly comprising:

an elongate support member for mounting in an inkjet printer body; and,

two or more printhead modules detachably mounted in series along the support member, the support member having a structural component for strengthening the member, and a mounting component for mounting the printhead modules; wherein,

the mounting component is connected to the structural component to allow relative thermal expansion, wherein the mounting component is connected to the structural component via an elastomeric element that allows relative thermal expansion and contraction.

2. A printhead assembly according to claim 1 wherein each of the printhead modules has an array of inkjet nozzles formed on a monolithic substrate and the coefficient of thermal expansion of the monolithic substrates is similar to that of the mounting component.

3. A printhead assembly according to claim 1 wherein the structural component is a beam with a channel section and the mounting component is a core house within the channel section.

4. A printhead assembly according to claim 3 wherein the channel is an aluminium extrusion and the core has ink supply channels for the printhead modules.

5. A printhead assembly according to claim 4 wherein the monolithic substrates and the core are predominantly formed from silicon.

6. A printhead assembly according to claim 1 wherein the printhead assembly is a pagewidth printer.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028543/0462 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2004
From: SILVERBROOK, KIA
To: SIVERBROOK RESEARCH PTY. LTD.
Reel/Frame 015553/0399 →