IP Library Granted Patent US 6,959,974
Granted Patent B2
US 6,959,974 · App. 10/882,765 · Granted Nov 1, 2005

Pagewidth printhead assembly

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Quick Facts
Patent No.
US 6,959,974
App. No.
10/882,765
Granted
Nov 1, 2005
Kind
B2
Abstract

A page width printhead assembly ( 1 ) for a digital inkjet printer has a support member that can be secured in the printer, and a printhead ( 2 ) that can be mounted to the support member. The support member has a core with at least one ink reservoir ( 6, 7, 8 and 9 ) enclosed within a laminated shell ( 4 ). The materials and structure of the shell ( 4 ) and the core ( 5 ) are selected and configured so that the co-efficient of thermal expansion of the support member as a whole is substantially equal to that of the printhead ( 2 ).

Claims (27)

1. A pagewidth printhead assembly for a page width printer, the assembly comprising:

a support member having an outer laminated shell portion and a core portion at least partially enclosed and restrained by the shell portion; and

a modular, pagewidth printhead mounted to the core portion, wherein the shell portion and the printhead have substantially the same effective coefficient of thermal expansion.

2. A printhead assembly according to claim 1 , wherein:

the pagewidth printhead is stationary and generally as long as the page width.

3. A printhead assembly according to claim 2 , wherein:

the shell portion is a laminated structure having an odd number of longitudinally extending continuous layers of at least two different metals wherein at least some of the layers are in a symmetrical arrangement.

4. A printhead assembly according to claim 1 , wherein:

the core portion has formed in it one or more ink reservoirs which collectively lead to one or more printhead micro mouldings which are carried by the core.

5. A printhead assembly according to claim 1 , wherein:

the laminated shell portion is formed from at least three metals laminated together, the laminate having inner and outer layers which have the same coefficient of thermal expansion.

6. A printhead assembly according to claim 1 , wherein:

the printhead is fabricated from silicon and constructed using micro electromechanical techniques.

7. A printhead assembly according to claim 1 , wherein:

the core portion is an extrusion in which is formed separate ink reservoirs.

8. A printhead assembly according to claim 1 , wherein:

the modular printhead comprises MEMS modules which are positioned end to end along the core.

9. A printhead assembly according to claim 8 , wherein:

each module further comprises ink nozzles, chambers and actuators.

10. A printhead assembly according to claim 1 , wherein:

the laminated shell portion comprises two or more different materials, each having a different coefficient of thermal expansion.

11. A printhead assembly according to claim 10 , wherein:

at least two materials have coefficients of expansion which are different than the coefficient of expansion of silicon.

12. A printhead assembly according to claim 11 , wherein:

the laminated shell portion comprises outer layers of invar.

13. A printhead assembly according to claim 1 , wherein:

the assembly has a composite coefficient of expansion generally equal to the coefficient of expansion silicon.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028539/0569 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2004
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY. LTD.
Reel/Frame 015555/0920 →