Method of fabricating an ink jet printhead chip with differential expansion actuators
View Patent ↗A method of fabricating an inkjet printhead chip includes the step of forming a layer of sacrificial material on a substrate, such that the layer is between three and ten microns thick. A first layer of thermal expansion material is formed on the sacrificial material. A heater circuit is formed on the first layer of thermal expansion material. The sacrificial material and the first layer of thermal expansion material are formed to permit the electrical circuit to make electrical contact with the drive circuitry. A second layer of the thermal expansion material is formed on the heater circuit. A suitable process is applied on the second layer of thermal expansion material to render a surface of the second layer hydrophilic. The sacrificial material is removed.
1. A method of fabricating a printhead chip for an inkjet printhead, the printhead chip including a wafer substrate that incorporates drive circuitry and defines a plurality of ink inlet channels, a plurality of nozzle arrangements positioned on the substrate, each nozzle arrangement including nozzle chamber walls that define a nozzle chamber and an ink ejection port in fluid communication with the nozzle chamber with an ink inlet channel opening into the nozzle chamber and an actuator that is positioned in the nozzle chamber, the actuator having an electrical circuit connected to the drive circuitry layer and positioned in thermal expansion material so that the expansion material experiences thermal expansion when the heating circuit receives an electrical signal from the drive circuitry layer and the actuator is displaced towards the ink ejection port to eject a drop of ink from the nozzle chamber, the method comprising the steps of:
forming a layer of sacrificial material on the substrate, such that the layer is between one and ten microns thick;
forming a first layer of the thermal expansion material on the sacrificial material;
forming the heater circuit on the first layer of thermal expansion material, the sacrificial material and the first layer of thermal expansion material being formed to permit the electrical circuit to make electrical contact with the drive circuitry;
forming a second layer of the thermal expansion material on the heater circuit wherein the expansion material is polytetrafluoroethylene (PTFE);
plasma processing the surface of the second layer of PTFE to render said surface hydrophilic; and
removing the sacrificial material.
2. A method as claimed in claim 1 , in which the layer of sacrificial material is formed to be between three and six microns thick.
3. A method as claimed in claim 1 , in which the thermal expansion material and the heater circuit are formed so that each actuator overlies a respective ink inlet opening.
4. A method as claimed in claim 1 , which includes the steps of forming a further layer of sacrificial material on the second layer of PTFE, forming the nozzle chamber walls on the second layer of sacrificial material such that the nozzle chamber walls define the nozzle chamber and the ink ejection port in fluid communication with the nozzle chamber and removing the second layer of sacrificial material.
5. A method as claimed in claim 1 which includes the step of forming the first and second layers of expansion material and the heater circuit such that the actuator is a laminated structure with the heater circuit sandwiched between the first and second layers of expansion material.