IP Library Granted Patent US 7,306,027
Granted Patent B2
US 7,306,027 · App. 10/883,450 · Granted Dec 11, 2007

Fluid-containing cooling plate for an electronic component

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Quick Facts
Patent No.
US 7,306,027
App. No.
10/883,450
Granted
Dec 11, 2007
Kind
B2
Abstract

A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Claims (38)

1. A cooling assembly comprising:

a first metal plate having an internal surface and an opposed surface;

a second metal plate having an internal surface and an opposed surface, said internal surface of said second plate facing said internal surface of said first plate and being parallel to said internal surface of said first plate;

an elongate material consisting of one of a wire and a tube at least partially forming a circuit, said elongate material comprising a core plated with brazeable metal, said elongate material being sandwiched between and bonded to said internal surfaces by brazing to form a chamber;

an inlet for introducing a fluid into said; and

a wicking structure in contact with at least one of the internal surfaces for promoting evaporation of said fluid in said chamber.

2. A cooling assembly as in claim 1 wherein said elongate material has a round cross section.

3. A cooling assembly as in claim 2 wherein at least one of said plates has a trench formed in said internal surface, said trench having an arcuate profile which receives said elongate material.

4. A cooling assembly as in claim 1 wherein said core comprises a material which is more electrically or magnetically dissipative than the material of the plates, whereby said core can be heated by exposure to an oscillating electric field or an oscillating magnetic field.

5. A cooling assembly as in claim 4 wherein said metal core is an iron-based core coated with copper, whereby said brazeable metal may be melted by induction heating of said core.

6. A cooling assembly as in claim 1 wherein said inlet is formed by a tube which is received through one of said plates.

7. A cooling assembly as in claim 1 wherein the inlet is formed as a tube which is received through an interruption in the elongate material.

8. A cooling assembly as in claim 1 wherein said chamber contains a fluid which evaporates readily at operating temperatures of a component to be cooled by said assembly.

9. A cooling assembly as in claim 1 further comprising a wicking structure formed integrally with at least one of said internal surfaces.

10. A cooling assembly as in claim 1 further comprising a plurality of spacers sandwiched between and bonded to said internal surfaces in said chamber to prevent deformation of said plates under positive or negative pressure.

11. A cooling assembly as in claim 10 wherein the spacers are slugs of solid wire, said wire being coated with brazeable metal prior to cutting.

12. A cooling assembly as in claim 11 wherein the spacers are formed into a shape which prevents the spacers from rolling when the spacers are placed on a plate prior to bonding.

13. A cooling assembly as in claim 1 further comprising cooling fins fixed to one of said opposed surfaces.

14. A cooling assembly comprising:

a first metal plate having an internal surface and an opposed surface:

a second metal plate having an internal surface and an opposed surface, said internal surface of said second plate facing said internal surface of said first plate and being parallel to said internal surface of said first plate;

an elongate material consisting of one of a wire and a tube at least partially forming a circuit, said elongate material comprising a core plated with brazeable metal, said elongate material being sandwiched between and bonded to said internal surfaces by brazing to form a chamber; and

an inlet for introducing a fluid into said chamber; wherein said core is copper and said brazeable metal is silver.

15. The cooling assembly of claim 14 wherein said first and second plates are made of copper.

16. The cooling assembly of claim 14 wherein said elongate material is bonded to said plates at filleted joints formed by a silver alloy.

17. A cooling assembly comprising:

a first metal plate having an internal surface and an opposed surface;

a second metal plate having an internal surface and an opposed surface, said internal surface of said second plate facing said internal surface of said first plate and being parallel to said internal surface of said first plate;

an elongate material consisting of one of a wire and a tube at least partially forming a circuit, said elongate material being sandwiched between and bonded to said internal surfaces to form a chamber;

an inlet for introducing a fluid into said chamber; and

a plurality of spacers sandwiched between and bonded to said internal surfaces in said chamber to prevent deformation of said plates under positive or negative pressure;

wherein the spacers comprise slugs of solid wire, said wire being coated with brazeable metal prior to cutting.

18. A cooling assembly as in claim 17 wherein the spacers are formed into a shape which prevents the spacers from rolling when the spacers are placed on a plate prior to bonding.

19. A cooling assembly as in claim 17 wherein said elongate material has a round cross section.

20. A cooling assembly as in claim 19 wherein at least one of said plates has a trench formed in said internal surface, said trench having an arcuate profile which receives said elongate material.

21. A cooling assembly as in claim 17 wherein said core comprises a material which is more electrically or magnetically dissipative than the material of the plates, whereby said core can be heated by exposure to on oscillating electric field or an oscillating magnetic field.

22. A cooling assembly as in claim 17 wherein said inlet is formed by a tube which is received through one of said plates.

23. A cooling assembly as in claim 17 wherein the inlet is formed as a tube which is received through an interruption in the elongate material.

Assignments (8)
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 29414/899 Recorded May 23, 2017
From: ANTARES CAPITAL LP, AS SUCCESSOR TO GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: AAVID THERMALLOY, LLC
Reel/Frame 042534/0891 →
ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Oct 7, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS RETIRING AGENT
To: ANTARES CAPITAL LP, AS SUCCESSOR AGENT
Reel/Frame 036810/0914 →
TERMINATION AND RELEASE OF ASSIGNMENT OF SECURITY INTEREST IN PATENTS BY SECURED PARTY PREVIOUSLY RECORDED AT REEL 025764 FRAME 0187 Recorded Mar 6, 2013
From: THE PRUDENTIAL INSURANCE COMPANY OF AMERICA
To: AAVID THERMALLOY, LLC; AAVID CORPORATION (F/K/A AAVID THERMAL PRODUCTS, INC.); AAVID THERMAL TECHNOLOGIES, INC.
Reel/Frame 029939/0907 →
SECURITY AGREEMENT Recorded Dec 6, 2012
From: AAVID THERMALLOY, LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 029414/0899 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL Recorded Apr 7, 2011
From: BANK OF AMERICA, N.A., SUCCESSOR BY MERGER TO LASALLE BUSINESS CREDIT, INC. AS AGENT
To: THERMALLOY, INC.; AAVID THERMALLOY, LLC; AAVID LABORATORIES, INC.; AAVID THERMAL PRODUCTS, INC.
Reel/Frame 026090/0074 →
ASSIGNMENT OF SECURITY INTEREST IN PATENTS Recorded Dec 22, 2010
From: AAVID ACQUISITION, INC.; AAVID THERMAL PRODUCTS, INC.; AAVID THERMALLOY, LLC
To: THE PRUDENTIAL INSURANCE COMPANY OF AMERICA, AS COLLATERAL AGENT
Reel/Frame 025764/0187 →
SECURITY AGREEMENT Recorded Oct 25, 2006
From: AAVID THERMALLOY, LLC
To: LASALLE BUSINESS CREDIT, INC.
Reel/Frame 018433/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2004
From: WHITNEY, BRADLEY R.; COOK, RANDOLPH H.; CENNAMO, JOHN R.; KANG, SUKHVINDER S.
To: AAVID THERMALLOY, LLC
Reel/Frame 015546/0827 →