Intermediate layer composition for multilayer resist process, pattern-forming process using the same, and laminate

1. An intermediate layer composition for multilayer resist process, the composition comprising polymer (A) having a repeating unit represented by the following formula (I):

wherein R 1 to R 7 are the same or different, and each represents a hydrogen atom, an alkyl group, an alkoxyl group, an aryl group, an aralkyl group, a cycloalkyl group or an alkenyl group; one of X, Y and Z represents a hydroxyl group, and the another one of X, Y and Z is —O—, and the other one of X, Y and Z is a group represented by following formula (IA) which is linked on the oxygen atom side; and

n represents from 0 to 10;

wherein R 11 to R 14 are the same or different, and each represents a hydrogen atom, an alkyl group, an alkoxyl group, an aryl group, an aralkyl group, a cycloalkyl group or an alkenyl group;

R 15 to R 17 are the same or different, and each represents a single bond or an alkylene group;

R 18 represents a single bond or —O—; and

m represents from 0 to 10.

2. The intermediate layer composition according to claim 1 , further comprising: (B) a radical generator.

3. The intermediate layer composition according to claim 1 , further comprising: (C) a crosslinking agent.

4. The intermediate layer composition according to claim 1 , further comprising: (D) a compound that generates an acid by heating.

5. The intermediate layer composition according to claim 1 , further comprising: (E) a radical polymerizable compound.

6. The intermediate layer composition according to claim 1 , further comprising: (F) an organic solvent.

7. The intermediate layer composition according to claim 1 , further comprising: (G) a surfactant.

8. A multilayer resist pattern-forming process comprising:

(a) forming a lower resist layer comprising an organic material on a substrate;

(b) laminating on the lower resist layer an intermediate layer and an upper resist layer comprising an organic material crosslinkable or decomposable upon irradiation with radiation; and

(c) forming a prescribed pattern on the upper resist layer, and then etching the intermediate layer, the lower layer and the substrate successively,

wherein the intermediate layer composition according to claim 1 is used in the intermediate layer.

9. The multilayer resist pattern-forming process according to claim 8 , wherein after coating the intermediate layer composition on the lower resist, the intermediate layer is insolubilized in an organic solvent by being baked.

10. A laminate comprising: a substrate, a lower resist layer comprising an organic material, an intermediate layer and an upper resist layer comprising an organic material crosslinkable or decomposable upon irradiation with radiation, in this order,

wherein the intermediate layer comprises polymer (A) having a repeating unit represented by the following formula (I):

wherein R 1 to R7 are the same or different, and each represents a hydrogen atom, an alkyl group, an alkoxyl group, an aryl group, an aralkyl group, a cycloalkyl group or an alkenyl group; one of X, Y and Z represents a hydroxyl group, and the another one of X, Y and Z is -O-, and the other one of X, Y and Z is a group represented by following formula (IA) which is linked on the oxygen atom side; and

n represents from 0 to 10;

wherein R 11 to R 14 are the same or different, and each represents a hydrogen atom, an alkyl group, an alkoxyl group, an aryl group, an aralkyl group, a cycloalkyl group or an alkenyl group;

R 15 to R 17 are the same or different, and each represents a single bond or an alkylene group;

R 18 represents a single bond or —O—; and

m represents from 0 to 10.