IP Library Granted Patent US 6,922,110
Granted Patent B2
US 6,922,110 · App. 10/884,254 · Granted Jul 26, 2005

Phase locked loop (PLL) frequency synthesizer and method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,922,110
App. No.
10/884,254
Granted
Jul 26, 2005
Kind
B2
Abstract

A phase locked loop (PLL) frequency synthesizer generates a high frequency signal by generating an output signal from a voltage controlled oscillator of a primary phase locked loop (PLL) circuit. The voltage controlled oscillator output is programmably divided with a reference signal output at a divide ratio such that the outputs are equal to a common phase comparison frequency. An external reference signal used for the primary phase locked loop circuit is isolated by generating a voltage controlled, clean reference signal and filtering and synchronizing the clean reference signal with the external reference signal within a secondary phase locked loop circuit to produce the reference signal output to the primary phase locked loop circuit.

Claims (31)

1. A phase locked loop (PLL) circuit, comprising:

a primary phase locked loop circuit for establishing a reference signal;

a secondary phase locked loop circuit operatively connected to the primary phase locked loop circuit for receiving, isolating and outputting a reference signal to the primary phase locked loop circuit;

a board on which the primary and secondary phase locked loop circuits are positioned;

a plurality of isolation vias formed in the board that isolate circuit components of the primary and secondary phase locked loop circuits; and

a support member on which the board is mounted.

2. A phase locked loop (PLL) circuit according to claim 1 , and further comprising a filter within the secondary phase locked loop circuit for filtering the reference signal and attenuating spurs that are outside the secondary phase locked loop bandwidth.

3. A phase locked loop (PLL) circuit according to claim 1 , wherein said primary phase locked loop circuit comprises a voltage controlled oscillator (VCO) circuit and programmable divide circuit for establishing a voltage controlled oscillator signal and a reference signal at a divide ratio such that the signals are equal to a common phase comparison frequency.

4. A phase locked loop (PLL) circuit according to claim 3 , wherein said primary phase locked loop circuit further comprises a frequency multiplier circuit operatively connected to said voltage controlled oscillator for multiplying the frequency of the signal from the voltage controlled oscillator.

5. A phase locked loop (PLL) circuit according to claim 3 , and further comprising a processor operatively connected to said programmable divide circuit for establishing desired divide ratios between the voltage controlled oscillator and reference signals.

6. A phase locked loop (PLL) circuit according to claim 1 , wherein said secondary phase locked loop circuit includes an oscillator for generating a voltage controlled, clean reference signal, wherein said secondary phase locked loop circuit filters and synchronizes the clean reference signal with an external reference signal.

7. A phase locked loop (PLL) circuit according to claim 1 , wherein said board comprises a printed wiring board.

8. A phase locked loop (PLL) circuit according to claim 1 , wherein said support is substantially matched as to its coefficient of thermal expansion with the board.

9. A phase locked loop (PLL) circuit according to claim 1 , and further comprising a housing cover having an interior surface and channels on the interior surface that receive individual circuit components when the housing cover is mounted on the support.

10. A phase locked loop (PLL) circuit according to claim 3 , and further comprising channelization walls that are juxtaposed against any isolation vias used for isolating individual circuit components.

11. A method of generating a high frequency signal which comprises:

positioning circuit components of primary and secondary phase lock loop circuits on a board;

isolating the circuit components using isolation vias;

mounting the board on a support;

generating a reference signal with the primary phase locked loop circuit;

receiving and isolating a reference signal used for the primary phase locked loop circuit in a secondary phased locked loop circuit that is operatively connected to the primary phase locked loop circuit; and

generating from the secondary phase locked loop circuit a reference signal to the primary phase locked loop circuit.

12. A method according to claim 11 , which comprises filtering the external reference signal within the secondary phase locked loop circuit and attenuating any spurs that are outside the secondary phase locked loop circuit bandwidth.

13. A method according to claim 11 , which comprises establishing a voltage controlled oscillator signal and a reference signal at a divide ratio such that signals are equal to a common phase comparison frequency.

14. A method according to claim 13 , which comprises multiplying the frequency of the reference signal.

15. A method according to claim 13 , which comprises establishing divide ratios between the voltage controlled oscillator signal and the reference signal using a processor.

16. A method according to claim 11 , which comprises generating a voltage controlled, clean reference signal and filtering and synchronizing the clean reference signal with an external reference signal for producing a reference signal to the primary phase locked loop circuit.

17. A method according to claim 11 , which comprises forming the board as a printed wiring board.

18. A method according to claim 11 , which comprises matching the coefficient of thermal expansion of the support with the board.

19. A method according to claim 11 , which comprises forming a housing cover having an interior surface and channels on the interior surface and receiving individual circuit components within the channels when the housing cover is mounted on the support.

20. A method according to claim 19 , which comprises forming channelization walls that are juxtaposed against isolation vias for isolating individual circuit components.

Assignments (2)
SECURITY AGREEMENT Recorded Jan 5, 2009
From: REVEAL IMAGING, LLC
To: BBH CAPITAL PARTNERS III, L.P.
Reel/Frame 022052/0517 →
TRANSFER FORM Recorded Nov 19, 2008
From: XYTRANS, INC.; CROSSHILL GEORGETOWN CAPITAL, LP
To: REVEAL IMAGING, LLC
Reel/Frame 021849/0932 →