Multi-layered circuit board assembly with improved thermal dissipation
View Patent ↗A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to dissipate heat generated in the assembly; and a molding resin surrounding the electrical component. Heat, generated at electrical components in a circuit board assembly, is transferred and dispersed through the high-temperature dissipation material all over the assembly. Further, since the high-temperature dissipation resin is of an insulating material, it is unnecessary to consider a short-circuit problem in the assembly.
1. A circuit board assembly, comprising:
a core substrate formed in the assembly;
an electrical component mounted on the core substrate;
a conductive layer formed at a side of the electrical component opposing the core substrate, so as to be connected to the electrical component;
a high-temperature dissipation resin, which is of insulating material and is formed to cover a side of the conductive layer opposing the electrical component so as to disperse heat generated in the assembly; and
a molding resin surrounding the electrical component and the high-temperature dissipation resin entirely, wherein:
a first heat transfer path is formed to extend from the electrical component via the conductive layer and the high-temperature dissipation resin, and
a second heat transfer path is formed to extend from the electrical component via the core substrate.
2. A circuit board assembly according to claim 1 , wherein
the high-temperature dissipation resin is formed to be in contact with the electrical component.
3. A circuit board assembly according to claim 1 , further comprising:
a via hole formed in the molding resin, wherein
the high-temperature dissipation resin is filled in the via hole.
4. A circuit board assembly according to claim 1 , wherein
the high-temperature dissipation resin is coated on the electrical component.
5. A circuit board assembly according to claim 4 , further comprising:
a via hole formed in the molding resin, wherein
the high-temperature dissipation resin is filled in the via hole.
6. A circuit board assembly according to claim 1 , wherein
the high-temperature dissipation resin is made of a silica-alumina system material having an emissivity of about 0.92.
7. A circuit board assembly according to claim 1 ,
wherein
the high-temperature dissipation resin is coated on a surface of the core substrate.
8. A circuit board assembly according to claim 7 , wherein
the high-temperature dissipation resin is coated on both surfaces of the core substrate.
9. A circuit board assembly according to claim 7 , wherein
the high-temperature dissipation resin is formed to be in contact with the electrical component.
10. A circuit board assembly according to claim 7 , further comprising:
a via hole formed in the molding resin, wherein
the high-temperature dissipation resin is filled in the via hole.
11. A circuit board assembly according to claim 7 , wherein
the high-temperature dissipation resin is coated on the conductive layer and the electrical component.
12. A circuit board assembly according to claim 11 , further comprising:
a via hole formed in the molding resin, wherein
the high-temperature dissipation resin is filled in the via hole.
13. A circuit board assembly according to claim 12 , wherein
the high-temperature dissipation resin is arranged to form a heat transfer path, through which a heat generated in the assembly is well dispersed.
14. A circuit board assembly according to claim 7 , wherein
the high-temperature dissipation resin is made of a silica-alumina system material having an emissivity of about 0.92.
15. A circuit board assembly according to claim 1 , further comprising:
a conductive frame, which is formed in the assembly and extends out of the assembly to be electrically connected to an external board.
16. A circuit board assembly according to claim 15 , wherein
the conductive frame is of copper.
17. A circuit board assembly according to claim 15 , wherein
the high-temperature dissipation resin is coated on the conductive layer.
18. A circuit board assembly according to claim 15 , wherein
the high-temperature dissipation resin is arranged to be in contact with the electrical component.
19. A circuit board assembly according to claim 15 , further comprising:
a via hole formed in the molding resin, wherein
the high-temperature dissipation resin is filled in the via hole.
20. A circuit board assembly according to claim 15 , wherein
the high-temperature dissipation resin is coated on the conductive layer and the electrical component.
21. A circuit board assembly according to claim 20 , further comprising:
a via hole formed in the molding resin, wherein
the high-temperature dissipation resin is filled in the via hole.
22. A circuit board assembly according to claim 15 , wherein
the high-temperature dissipation resin is made of a silica-alumina system material having an emissivity of about 0.92.
23. A circuit board assembly according to claim 1 , wherein
the high-temperature dissipation resin formed to cover the side of the conductive layer opposing the electrical component has a thickness in the range from 30 to 200 μm.
24. A circuit board assembly, comprising:
a core substrate formed in the assembly;
an electrical component mounted on the core substrate;
a conductive layer formed at a side of the electrical component opposing the core substrate, so as to be connected to the electrical component;
a high-temperature dissipation resin, which is of insulating material and is formed to cover a side of the conductive layer opposing the electrical component so as to disperse heat generated in the assembly;
a molding resin surrounding the electrical component and the high temperature dissipation resin entirely, wherein:
a first heat transfer path is formed to extend from the electrical component via the conductive layer and the high-temperature dissipation resin,
a second heat transfer path is formed to extend from the electrical component via the core substrate; and
the high-temperature dissipation resin is coated on selected areas within the assembly comprising at least one of the conductive layer and a surface of the core substrate.