Failure analysis methods and systems
View Patent ↗A method and system for exposing the delicate structures of a device encapsulated in a mold compound such as an integrated circuit (IC). A laser is used to ablate the mold compound and thus remove it, exposing the underlying structure. The laser beam can be steered in a desired raster pattern onto the surface of the device or the device can be moved in the desired pattern relative to the laser beam. Spectral analysis can be performed on the laser plume emitted by the ablation process in order to determine the composition of the ablated material. Thus, in addition to exposing defects in the underlying structure, the system can also be used to analyze the encapsulating material in order to determine whether it contained any defects or anomalies. A system for precisely cutting a circuit board or an IC in a user-selected pattern is also described. The system directs a laser along a path that a user can specify using a graphical interface.
1. A method for exposing a structure encapsulated with a material, comprising:
generating a laser beam;
directing the laser beam onto the structure encapsulated with the material;
providing at least one reflective paddle actuated by a high-speed galvanometer motor to accomplish the directing step; and
ablating the material with the laser beam so as to expose at least an underlying portion of the structure without damaging the underlying portion.
2. The method of claim 1 , wherein the encapsulated structure includes an integrated circuit.
3. The method of claim 1 , wherein the laser beam has a wavelength within a range of approximately 266 nm to 10,640 nm.
4. The method of claim 1 , wherein ablating the material creates a heat affected zone that is no larger than 1 micron.
5. The method of claim 1 comprising:
providing a relative displacement between the laser beam and the encapsulated structure to ablate the material over an area.
6. The method of claim 5 , wherein the encapsulated structure is moved and the laser beam is fixed.
7. The method of claim 5 , wherein the laser beam is movably steered onto the encapsulated structure.
8. The method of claim 7 comprising focusing the laser beam in a plane.
9. The method of claim 8 , wherein the laser beam is focused in a plane using at least one of a flat field lens and a telecentric lens.
10. A method for exposing a structure encapsulated with a material, comprising:
generating a laser beam;
directing the laser beam onto the structure encapsulated with the material; and
ablating the material with the laser beam so as to expose at least a portion of the structure without damaging the structure; and
analyzing a plume generated by ablating the material to determine a composition of the material.
11. The method of claim 10 comprising:
determining a position of the laser beam so as to provide a spatial representation of the composition of the material.
12. An apparatus for exposing a structure encapsulated with a material, comprising:
a laser beam source;
a first mechanism configured to direct the laser beam onto the structure encapsulated with the material; and
a second mechanism configured to control the position, and depth, of the laser beam so as to expose, by ablation, at least an underlying portion of the structure without damaging the underlying portion;
wherein at least the first mechanism is a reflective paddle actuated by a high-speed galvanometer motor.
13. The apparatus of claim 12 , further configured so that the laser beam is steered onto the structure.
14. The apparatus of claim 12 , further configured so that the structure is moved and the laser beam is in a fixed position.
15. The apparatus of claim 12 , further configured to determine the position of the laser beam so as to provide a spatial representation of the composition of the material.
16. The apparatus of claim 12 , further including at least one of a flat field lens and a telecentric lens so as to focus the laser beam in a plane.