Packaged accelerometer
View Patent ↗A micro machined accelerometer package includes a chip having a top surface and a bottom surface. A micro machined accelerometer is formed in the chip, the accelerometer including a mass cantilevered from the remainder of the chip to be movable out of the plane of the chip, one or more motion detectors for detecting motion of the mass, processing circuitry and one or more bond pads for communicating detected accelerations. A first hollow molded cap is bonded to the top surface over at least part of the accelerometer to define a first cavity into which the cantilevered mass may move. The first molded cap is bonded to the chip such that the cap covers the mass, the motion detectors and the processing circuitry but leaves the bond pads uncovered.
1. A micro machined accelerometer package including:
a integrated circuit having a top surface and a bottom surface and having a micro machined accelerometer formed in the integrated circuit, the accelerometer including a mass cantilevered from the remainder of the integrated circuit to be movable out of the plane of the integrated circuit, one or more motion detectors for detecting motion of the mass, processing circuitry and one or more bond pads exposed on the top surface for communicating detected accelerations;
a first hollow molded cap bonded to the top surface over at least part of the accelerometer to define a first cavity into which the cantilevered mass may move,
wherein the first molded cap is bonded to the integrated circuit such that the cap covers the mass, the motion detectors and the processing circuitry and wherein the cap does not cover the bond pads;
the accelerometer further including a second cap bonded to the second surface of the integrated circuit over at least part of the accelerometer to define a second cavity into which the cantilevered mass may move.
2. An accelerometer package of claim 1 further including an array of said micro machined accelerometers formed in the integrated circuit and an array of molded caps bonded to the top surface over said array of accelerometers.