High-speed electrical connector
View Patent ↗The present invention provides a high-speed connector.
1. An interconnect system, comprising:
a first circuit board comprising (a) a first differential interconnect path, (b) a first socket on a surface of the first circuit board and (c) a second socket also on the surface of the first circuit board, wherein the first differential interconnect path comprises a first signal path electrically connected to the first socket and a second signal path electrically connected to the second socket;
a second circuit board comprising a second differential interconnect path; and
a connector for electrically connecting the first differential interconnect path with the second differential interconnect path, the connector comprising:
an interposer having a first face and a second face opposite the first face, the first face facing the surface of the first circuit board, said interposer including an array of apertures extending from the first face of the interposer to the second face of the interposer;
a first conductor having an end adjacent to the second face of the interposer;
a second conductor substantially parallel with and substantially equal in length to the first conductor, the second conductor also having an end adjacent to the second face of the interposer;
a dielectric material disposed between the first conductor and the second conductor;
a plurality of cells located within said array of apertures, each of said cells including a housing supporting a first elongated contact member and a second elongated contact member;
a first of said first elongated contact members having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the end of the first conductor, the board contact section being in physical contact with and compliantly engaged with the first socket, and at least a portion of the interim section being engaged with a first of said housings; and
a first of said second elongated contact members having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the first end of the second conductor, the board contact section being in physical contact with and compliantly engaged with the second socket, and at least a portion of the interim section being engaged with said first of said housings.
2. The interconnect system of claim 1 , wherein said housings are made with dielectric material.
3. The interconnect system of claim 1 , wherein said housings are made with dielectric material and said interposer is made with conductive material or is coated with conductive material.
4. The interconnect system of claim 3 , wherein said interposer is made with metal.
5. The interconnect system of claim 1 , wherein the dielectric material disposed between the first conductor and the second conductor comprises a third circuit board having a first face and a second face.
6. The interconnect system of claim 5 , wherein the first conductor is disposed on the first face of the third circuit board and the second conductor is disposed on the second face of the third circuit board.
7. The interconnect system of claim 6 , wherein the third circuit board is sandwiched between a first spacer and a second spacer.
8. The interconnect system of claim 7 , wherein the first spacer has a groove on a first face thereof and the groove is aligned with and mirrors the first conductor.
9. The interconnect system of claim 7 , wherein the first spacer has at least one finger for attaching the spacer to the interposer.
10. The interconnect system of claim 9 , wherein the interposer has at least one recess for receiving the at least one finger.
11. The interconnect system of claim 8 , wherein the second spacer has a groove on a first face thereof and the groove is aligned with and mirrors the second conductor.
12. The interconnect system of claim 1 , wherein said first of said housings includes a slot configured to receive said a third circuit board.
13. The interconnect system of claim 12 , wherein said first of said housings further includes channels configured to receive said conductor contact sections of said first and second elongated contact members.
14. The interconnect system of claim 13 , wherein said conductor contact sections are flexibly contained within said channels and wherein said channels extend past distal ends of each of said first and second elongated contact members.
15. The interconnect system of claim 1 , wherein said board contact sections include pins with a diameter of less than about 0.04 inches.
16. The interconnect system of claim 1 , wherein said board contact sections include pins with a diameter of less than about 0.03 inches.
17. The interconnect system of claim 1 , wherein said board contact sections include pins with a diameter of less than about 0.02 inches.
18. The interconnect system of claim 1 , wherein said housings have widths of less than about 0.3 inches.
19. The interconnect system of claim 1 , wherein said housings have widths of less than about 0.2 inches.
20. The interconnect system of claim 1 , wherein said housings have widths of less than about 0.15 inches.
21. The interconnect system of claim 1 , wherein said connector supports differential applications at more than about 5 GBPS.
22. The interconnect system of claim 1 , wherein said connector supports differential applications at more than about 10 GBPS.
23. An interposer assembly for high-speed and high density differential applications, comprising:
a) an interposer having a first face and a second face opposite the first face;
b) said interposer including an array of apertures extending from the first face of the interposer to the second face of the interposer;
c) a plurality of cells located within said array of apertures, each of said cells including a housing supporting a first elongated contact member and a second elongated contact member;
d) said interposer being made with a conductive material or coated with a conductive material;
e) said housings each being made with dielectric material;
f) a first of said first elongated contact members having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being configured to apply a pressure contact without attachment to a first conductor, the board contact section including a compliant pin having a diameter of less than about 0.04 inches, and at least a portion of the interim section being engaged with a first of said housings; and
g) a first of said second elongated contact members having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being configured to apply a pressure contact without attachment to a second conductor, the board contact section including a compliant pin having a diameter of less than about 0.04 inches, and at least a portion of the interim section being engaged with said first of said housings.
24. The interposer assembly of claim 23 , wherein said first of said housings includes a slot configured to receive an edge of a circuit board located generally perpendicular to said interposer.
25. The interposer assembly of claim 24 , wherein said first of said housings further includes channels configured to receive said conductor contact sections of said first and second elongated contact members.
26. The interposer assembly of claim 25 , wherein said conductor contact sections are flexibly contained within said channels and wherein said channels extend past distal ends of each of said first and second elongated contact members.
27. The interposer assembly of claim 23 , wherein said pins each have a diameter of less than about 0.03 inches.
28. The interposer assembly of claim 23 , wherein said pins each have a diameter of less than about 0.02 inches.
29. The interposer assembly of claim 23 , wherein said housings each have widths of less than about 0.3 inches.
30. The interposer assembly of claim 23 , wherein said housings each have widths of less than about 0.2 inches.
31. The interposer assembly of claim 23 , wherein said assembly supports differential applications at more than about 5 GBPS.
32. The interposer assembly of claim 23 , wherein said assembly supports differential applications at more than about 10 GBPS.
33. A connector for high-speed and high density differential applications electrically connecting a signal path on a first circuit board with a signal path on a second circuit board, comprising:
a) an interposer having a first face and a second face opposite the first face;
b) said interposer including an array of apertures extending from the first face of the interposer to the second face of the interposer;
c) a plurality of cells located within said array of apertures, each of said cells including a housing supporting a first elongated contact member and a second elongated contact member;
d) said interposer being made with conductive material or coated with conductive material;
e) said housings each being made with dielectric material;
f) a plurality of circuit boards extending generally perpendicular to said interposer;
g) a plurality of spacers between said circuit boards; and
f) said housings each including a slot configured to receive an edge of a respective one of said circuit boards.
34. The connector of claim 33 , wherein said first and second elongated contact members include leaf springs that press against respective conductors on said circuit boards.
35. The connector of claim 33 , wherein the said circuit boards include a plurality of signal conductors, and wherein a number of signal conductors disposed on a first face of one of said circuit boards is not equal to a number of signal conductors disposed on a first face of a second circuit board.
36. The connector of claim 35 , wherein the number of signal conductors disposed on the second face of the first circuit board is one less or one more than the number of signal conductors disposed on the first face of the second circuit board.
37. The system of claim 33 , wherein each housing includes at least one tab arranged to mate with at least one corresponding slot in said interposer.
38. The system of claim 35 , wherein said conductors of adjacent circuit boards are staggered to increase distances between said conductors of said adjacent printed circuit boards.
39. The system of claim 33 , further comprising a backbone including slots arranged to receive said plurality of spacers.
40. The system of claim 33 , further comprising an end plate arranged to contain one of said interposers.
41. The system of claim 33 , further comprising a shield plate arranged to cover two sides of the system.
42. A method of manufacturing a connector, comprising:
a) providing an interposer with an array of apertures extending from a first face of the interposer to a second face of the interposer, wherein said interposer is made with conductive material or coated with conductive material;
b) providing a plurality of cells each including a housing supporting a first elongated contact member and a second elongated contact member, each said housing being made with dielectric material, and each said housing including a slot configured to receive an edge of a respective circuit board;
c) moving a plurality of printed circuit boards in a direction generally perpendicular to and towards said interposer such that edges of said printed circuit boards are received within respective ones of said slots in said housings and such that said first and second elongated contact members engage respective conductors on opposite sides of said printed circuit boards.
43. The method of claim 42 , wherein said first and second elongated contact members engage respective conductors on opposite sides of said printed circuit boards by providing said first and second elongated contact members with leaf spring portions that are displaced by the printed circuit boards upon insertion into said slots.
44. The method of claim 42 , further including aligning a plurality of spacers in between said printed circuit boards by inserting protrusions extending from said spacers into engaging recesses in said interposer.
45. The method of claim 42 , further including inserting said housing into said interposer until an outwardly extending tab is received within a respective slot in said interposer.
46. The method of claim 42 , wherein said first of said housings further includes channels configured to receive said conductor contact sections of said first and second elongated contact members.
47. The method of claim 46 , wherein said conductor contact sections are flexibly contained within said channels and wherein said channels extend past distal ends of each of said first and second elongated contact members.
48. The method of claim 42 , wherein said first and second contact members include complaint pins having a diameter of less than about 0.03 inches.
49. The method of claim 48 , wherein said pins have a diameter of less than about 0.02 inches.
50. The method of claim 42 , wherein said housings have widths of less than about 0.3 inches.
51. The method of claim 50 , wherein said housings have widths of less than about 0.2 inches.
52. The method of claim 42 , wherein said connector is configured to support differential applications at more than about 5 GBPS.
53. The method of claim 52 , wherein said connector is configured to support differential applications at more than about 10 GBPS.