IP Library Granted Patent US 7,295,406
Granted Patent B2
US 7,295,406 · App. 10/897,454 · Granted Nov 13, 2007

Narrow track extraordinary magneto resistive [EMR] device

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Quick Facts
Patent No.
US 7,295,406
App. No.
10/897,454
Granted
Nov 13, 2007
Kind
B2
Abstract

An extraordinary magnetoresistive sensor having optimal magnetic sensitivity capable of reading a very narrow and short magnetic bit. The sensor includes a layer of semiconductor layer and a layer of electrically conductive material. The first and second leads are electrically connected with an edge of the semiconductor material, one of the leads being located a distance inward from an end of the sensor. The sensor also includes first and second voltage leads, located on either side of and close to one of the current leads.

Claims (60)

1. A magnetoresistive sensor, comprising:

a layer of electrically conductive material;

a layer of semi-conductor material formed adjacent to and contacting the layer of electrically conductive material, the layer of semi-conductor material having an edge surface opposite the non-magnetic electrically conductive material and having first and second ends separated by a length (L);

first and second electrically conductive current leads, in electrical communication with the semi-conductor material; and

first and second electrically conductive voltage leads in electrical communication with the semiconductor material, the second current lead being located between the first and second voltage leads, and wherein the first and second voltage leads are each separated from the second current lead by a distance no greater than L/20.

2. A sensor as in claim 1 wherein the first and second voltage leads are each separated from the second current lead by a distance of about the size of the magnetic region or bit to be resolved or imaged.

3. A sensor as in claim 1 wherein the second current lead is located a distance 2L/3 from one of the first and second ends of the layer of semi-conductor material.

4. A sensor as in claim 1 wherein the second current lead is located a distance greater than L/3 and less than 5L/6 from one of the first and second ends of the layer of semi-conductor material.

5. A sensor as in claim 1 wherein the layer of semiconductor material has a width (W) in a direction perpendicular to the length (L), and wherein the ratio of W/L, is between L/10 and L/30.

6. A sensor as in claim 1 wherein the layer of semiconductor material has a width (W) in a direction perpendicular to the length (L), and wherein the ratio of W/L is between ⅕ and 1/60.

7. A magnetoresistive sensor, comprising:

a layer of non-magnetic, highly electrically conductive material;

a layer of semi-conductor material formed adjacent to and contacting the layer of electrically conductive material, the layer of semi-conductor material having an edge surface opposite the non-magnetic electrically conductive material and having first and second ends separated by a length (L);

first and second electrically conductive current leads, in electrical communication with the semi-conductive material; and

first and second electrically conductive voltage leads in electrical communication with the semiconductor material, the second current lead being located between the first and second voltage leads, and wherein the first and second voltage leads are each separated from one another by a distance less than L/5.

8. A sensor as in claim 7 wherein the second current lead is located a distance greater than L/3 and less than 5L/6 from one of the first and second ends of the layer of semi-conductor material.

9. A sensor as in claim 7 wherein the second lead is located distance of about 2L/3 from one of the first and second ends of the layer of semi-conductor material.

10. A sensor as in claim 7 wherein the layer of semiconductor material has a width (W) in a direction perpendicular to the length (L), and wherein the ratio of W/L is between ⅕ and 1/60.

11. A sensor as in claim 7 wherein the layer of semiconductor material has a width (W) in a direction perpendicular to ti e length (L), and wherein the ratio of W/L is between L/10 and L/30.

12. A sensor as in claim 7 further comprising a magnetic shield disposed adjacent to the semiconductor layer and the electrically conductive layer.

13. A sensor as in claim 7 wherein the sensor does not include a magnetic shield.

14. A sensor as in claim 7 wherein the semiconductor is a high mobility, small bandgap material.

15. A sensor as in claim 7 wherein the semiconductor is a modulation doped semiconductor involving a 2DEG quantum well, and wherein the layer of highly electrically conductive material comprises a metal.

16. A sensor as in claim 7 wherein the layer of semiconductor material and the layer of electrically conductive material form an Ohmic interface there between.

17. A sensor as in claim 7 further comprising a layer of material intercalated between the layer of semiconductor material and the layer of electrically conductive material to form an Ohmic contact between the layer of semiconductor material and the layer of electrically conductive material.

18. A magnetic data recording system, comprising:

a magnetic medium;

an actuator;

a slider connected with the actuator, the actuator being operable to move the slider over desired locations adjacent to the magnetic medium; and

a magnetoresistive sensor connected with the slider, the sensor further comprising:

a layer of non-magnetic, electrically conductive material;

a layer of semi-conductor material formed adjacent to and contacting the layer of electrically conductive material, the layer of semi-conductor material having an edge surface opposite the non-magnetic electrically conductive material and having first and second ends separated by a length (L);

first and second electrically conductive current leads in electrical communication with the semi-conductive material; and

first and second electrically conductive voltage leads in electrical communication with the semiconductor material, the second current lead being located between the first and second voltage leads, and wherein the first and second voltage leads are each separated from one another by a distance less than L/5.

19. A scanning magnetometer, comprising:

a chuck for holding a workpiece;

an actuator; and

a magnetoresistive sensor connected with the actuator for movement over the chuck, the sensor further comprising:

a layer of non-magnetic, electrically conductive material;

a layer of semi-conductor material formed adjacent to and contacting the layer of electrically conductive material, the layer of semi-conductor material having an edge surface opposite the non-magnetic electrically conductive material and having first and second ends separated by a length (L);

first and second electrically conductive current leads in electrical communication with the semi-conductive material; and

first and second electrically conductive voltage leads in electrical communication with the semiconductor material, the second current lead being located between the first and second voltage leads, and wherein the first and second voltage leads are each separated from one another by a distance less than L/5.

20. A scanning magnetic imaging device, comprising:

a chuck for holding a workpiece;

an actuator; and

a magnetoresistive sensor connected with the actuator for movement over the chuck, the sensor further comprising:

a layer of non-magnetic, electrically conductive material;

a layer of semi-conductor material formed adjacent to and contacting the layer of electrically conductive material, the layer of semi-conductor material having an edge surface opposite the non-magnetic electrically conductive material and having first and second ends separated by a length (L);

first and second electrically conductive current leads in electrical communication with the semi-conductive material; and

first and second electrically conductive voltage leads in electrical communication with the semiconductor material, the second current lead being located between the first and second voltage leads, and wherein the first and second voltage leads are each separated from one another by a distance less than L/5.

21. A magnetoresistive sensor, comprising:

a layer of electrically conductive material;

a layer of semi-conductor material formed adjacent to and contacting the layer of electrically conductive material, the layer of semi-conductor material having an edge surface opposite the non-magnetic electrically conductive material and having first and second ends separated by a length (L);

first and second electrically conductive current leads, in electrical communication with the semi-conductor material; and

first and second electrically conductive voltage leads in electrical communication with the semiconductor material, the second current lead being located between the first and second voltage leads, and wherein the first and second voltage leads are each separated from the second current lead by a distance no greater than 30 nm.

22. A magnetoresistive sensor, comprising:

a layer of electrically conductive material;

a layer of semi-conductor material formed adjacent to and contacting the layer of electrically conductive material, the layer of semi-conductor material having an edge surface opposite the non-magnetic electrically conductive material and having first and second ends separated by a length (L);

first and second electrically conductive current leads, in electrical communication with the semiconductor material; and

first and second electrically conductive voltage leads in electrical communication with the semiconductor material, the second current lead being located between the first and second voltage leads, and wherein the first and second voltage leads are each separated from the second current lead by a distance no greater than 20 nm.

Assignments (5)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2004
From: CHATTOPADHYAY, AMITAVA; FONTANA, ROBERT E. JR.; GURNEY, BRUCE ALVIN; MAAT, STEFAN; MARINERO, ERNESTO E.
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLAND, B.V.
Reel/Frame 015614/0418 →