IP Library Granted Patent US 7,022,191
Granted Patent B2
US 7,022,191 · App. 10/899,014 · Granted Apr 4, 2006

Method of crystallizing amorphous silicon layer and crystallizing apparatus thereof

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Quick Facts
Patent No.
US 7,022,191
App. No.
10/899,014
Granted
Apr 4, 2006
Kind
B2
Abstract

The present invention is related to a method of crystallizing an amorphous silicon layer and a crystallizing apparatus thereof which crystallize an amorphous silicon layer using plasma. The present invention includes the steps of depositing an inducing substance for silicon crystallization on an amorphous silicon layer by plasma exposure, and carrying out annealing on the amorphous silicon layer to the amorphous silicon layer. The present invention includes a chamber having an inner space, a substrate support in the chamber wherein the substrate support supports a substrate, a plasma generating means in the chamber wherein the plasma generating means produces plasma inside the chamber, and a heater at the substrate support wherein the heater supplies the substrate with heat.

Claims (16)

1. A crystallizing apparatus, comprising:

a chamber having inner space;

a substrate support arranged in the chamber, the substrate support being used for supporting a substrate having an amorphous silicon layer formed thereon;

a plasma generating device having a metal source connected to a power supply, the plasma generating device producing plasma inside the chamber by supplying the metal source with RF or DC power from the power supply to deposit a crystallization catalyst on an exposed surface of the amorphous silicon layer;

a heater arranged at the substrate support, the heater supplying the substrate with heat for performing crystallization while the plasma generating device produces the plasma inside the chamber, wherein the performing crystallization is carried out for less than about 50 minutes.

2. The crystallizing apparatus according to claim 1 , wherein the chamber has a gas inlet through which gas as a plasma source is provided to the chamber.

3. The crystallizing apparatus according to claim 1 , wherein the chamber has an outlet for exhausting fluid.

4. The crystallizing apparatus according to claim 1 , wherein the heat supplied by the heater is in a range from 300° C. to 1000° C.

5. A crystallizing apparatus, comprising:

a chamber having inner space;

a plasma generating device having a metal source connected to a power supply, the plasma generating device producing plasma inside the chamber by supplying the metal source with RF or DC power from the power supply to deposit a crystallization catalyst on an exposed surface of the amorphous silicon layer;

a substrate support arranged in the chamber, the substrate support being used for supporting a substrate having an amorphous silicon layer formed thereon, the substrate being isolated from the power supply; and

a heater arranged at the substrate support, the heater supplying the substrate with heat for performing crystallization while the plasma generating device produces plasma inside the chamber.

6. The crystallizing apparatus according to claim 5 , wherein the metal source has a mesh shape.

7. The crystallizing apparatus according to claim 5 , wherein the metal source includes one of Au, Ag, Al, Sb, In, Ni, Mo, Pd, Co, Ti, Cu, Fe and Cr.

8. The crystallizing apparatus according to claim 5 , wherein the metal atom of the metal source forms a metal-silicide during the crystallization.

Assignments (2)
CHANGE OF NAME Recorded Oct 17, 2008
From: LG.PHILIPS LCD CO., LTD.
To: LG DISPLAY CO., LTD.
Reel/Frame 021754/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2004
From: LG.PHILIPS LCD CO., LTD.
To: JANG, JIN
Reel/Frame 015617/0307 →