IP Library Granted Patent US 7,132,160
Granted Patent B2
US 7,132,160 · App. 10/900,719 · Granted Nov 7, 2006

Laminate tape

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Quick Facts
Patent No.
US 7,132,160
App. No.
10/900,719
Granted
Nov 7, 2006
Kind
B2
Abstract

A laminate tape useful for insulating pipes, lines and the like is constructed of a tacky first layer containing asphalt and an insulative filler such as granulated cork adhered to a flexible second layer that is less tacky. The flexible second layer contains a rubber such as butyl rubber.

Claims (16)

1. A method of insulating a component of a heating, ventilation, and air conditioning unit wherein said component comprises a metallic substrate having an outer surface and having another surface which is in contact with a hot or cold gas or liquid, said method comprising:

a). providing a laminate tape comprised of i) a tacky first layer comprised of asphalt, rubber, and particulate cork filler and having a thickness of from about 0.05 inches to about 0.25 inches and b) a second layer which is essentially non-tacky and comprised of a rubber, said second layer having a thickness of from about 0.02 inches to about 0.15 inches and being no greater in thickness than said tacky first layer, wherein one side of said tacky first layer is adhered to one side of said second layer, the width of said second layer is from about 100% to about 120% the width of said tacky first layer, and said tacky first layer and said second layer each have a width of from about 1.5 inches to about 3.5 inches; and

b). pressing said tacky first layer of the laminate tape against said outer surface of said metallic substrate to conform and adhere said laminate tape to said outer surface.

2. The method of claim 1 , wherein said component is elongated and the laminate tape is wrapped around said component in a spiral or helical manner.

3. The method of claim 1 , wherein strips of said laminate tape are applied side-by-side onto said outer surface in a manner such that the outer edges of the second layers in adjacent strips abut each other.

4. The method of claim 1 , wherein said outer surface is curved or contains a sharp angle.

5. The method of claim 1 , wherein said component is selected from the group consisting of pipes, conduits, ducts, and joints.

6. The method of claim 1 , wherein said component is an automotive component.

7. The method of claim 1 , wherein said second layer is comprised of butyl rubber.

8. The method of claim 1 , wherein said laminate tape has been produced by coextrusion.

9. The method of claim 1 , wherein said second layer is comprised of from about 1 to about 10 weight percent butyl rubber, about 20 to about 80 weight percent filler, and about 10 to about 30 weight percent plasticizer/processing oil.

10. The method of claim 1 , wherein said component contains a refrigerant.

11. The method of claim 1 , wherein said tacky first layer is comprised of about 30 to about 60 weight percent asphalt, about 10 to about 60 weight percent rubber, and about 10 to about 50 weight percent particulate cork filler.

12. The method of claim 1 , wherein the second layer has a needle penetration value (ASTM D1321; 50 g total load; 23±2 degrees C.; 5 seconds) of from about 3 to about 20.

13. The method of claim 1 , wherein said laminate tape is completely conformable at room temperature to a substrate surface containing a 90 degree angle upon application by hand using normal finger pressure and remains in such conformance indefinitely upon release of such pressure.

14. The method of claim 1 , wherein said tacky first layer has a needle penetration value (ASTM D1321; 100 g total load; 23±2 degrees C; 5 seconds) of from about 2.5 to about 6.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
CHANGE OF NAME Recorded Jul 26, 2010
From: HENKEL KGAA
To: HENKEL AG & CO. KGAA
Reel/Frame 024767/0085 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2004
From: FOX, GARY D.
To: HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN
Reel/Frame 015078/0844 →