Method for coating package with a filter profile
View Patent ↗Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.
1. A method for packaging a photo detector integrated circuit (IC) comprising,
(a) providing a substrate;
(b) providing an integrated circuit having a first upper surface and a photo-detector facing the upper surface to sense light impinging on a portion thereof;
(c) at least one of attaching and disposing a first filter on the first upper surface over the photodetector;
(d) mounting the integrated circuit on the substrate;
(e) disposing a light transmissive epoxy over the first light filter and at least portions of the integrated circuit and the substrate to form an epoxy encapsulation thereover, the epoxy encapsulation having a second upper surface, and
(f) disposing a coating over at least portions of the second epoxy surface to form a second filter.
2. The method of claim 1 , wherein the first filter is a pigment filter.
3. The method of claim 2 , wherein the pigment filter is an RGB filter.
4. The method of claim 2 , wherein the pigment filter is a CMY filter.
5. The method of claim 1 , wherein second filter comDrises an interference filter.
6. The method of claim 5 , wherein the second filter is configured to block or attenuate infrared (IR) radiation.
7. The method of claim 1 , further comprising fabricating the substrate in matrix forms.
8. The method of claim 1 , further comprising performing oven curing.
9. The method of claim 1 , further comprising performing singulation by employing at least one of trimming, forming and sawing.
10. The method of claim 1 , further comprising performing at least one of functional testing of the package, inspecting the package and packing the package.