Bonding methods for microchannel plates
View Patent ↗Mating faces of a microchannel plate (MCP) ( 50 ) and a multi-layer ceramic body ( 80 ) unit are deposited with a thin film having protuberances ( 84 ) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP ( 50 ) and multi-layer ceramic body ( 80 ) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP ( 50 ) and the multi-layer ceramic body unit ( 80 ).
1. A method for bonding a microchannel plate (MCP) to a multi-layer ceramic body (MLC) unit comprising the steps of:
mating surfaces of the microchannel plate (MCP) and the multi-layer ceramic body (MLC) unit are deposited with a thin film using a suitable metal selected for optimum diffusion at elevated temperatures and pressure; the film deposition of the surface of the multi-layer ceramic body is formed having protuberances placed compatible for bonding of the mating surfaces of the MCP and MLC;
a metallized MCP and MLC body unit are aligned and placed in a bonding fixture for applying a force sufficient to initiate a diffusion bond between the mating surfaces of the MCP and MLC at a selected elevated temperature; and
the bonding fixture is placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP and the multi-layer ceramic body unit.
2. The invention of claim 1 wherein the protuberance is formed from a metal selected from the group consisting of gold, silver, nickel, platinum, and palladium.