Flip-chip light-emitting device with micro-reflector
View Patent ↗A Flip-chip light-emitting device with integral micro-reflector. The flip-chip light-emitting device emits reflected light provided by a light-emitting layer. The micro-reflector reflects light that might otherwise be lost to internal refraction and absorption, so as to increase light-emitting efficiency.
1. A flip-chip light-emitting device with a micro-reflector comprising:
a substrate;
a micro-reflector formed over the substrate, the micro-reflector comprising:
a transparent patterned light-emitting stack layer having a plurality of convex surfaces opposite to the substrate; and
a reflective layer formed conformably over the transparent patterned light-emitting stack layer;
wherein the transparent patterned light-emitting stack layer comprises a first cladding layer, a light-emitting layer, and a second cladding layer; and
wherein the plurality of convex surfaces reach at least one of the first cladding layer and the second cladding layer.
2. The flip-chip light-emitting device with a micro-reflector of claim 1 further comprising a first contact layer between the first cladding layer the substrate.
3. The flip-chip light-emitting device with a micro-reflector of claim 1 further comprising a second contact layer between the second cladding layer and the reflective layer.
4. The flip-chip light-emitting device with a micro-reflector of claim 1 further comprising a transparent conductive layer between the transparent patterned light-emitting stack layer and the substrate.
5. The flip-chip light-emitting device with a micro-reflector of claim 4 wherein the transparent conductive layer comprises a material selected from a material group consisting of indium tin oxide, cadmium tin oxide, antimony tin oxide, zinc oxide, and zinc tin oxide.
6. The flip-chip light-emitting device with a micro-reflector of claim 1 further comprising an adhesive layer between the micro-reflector and the substrate.
7. The flip-chip light-emitting device with a micro-reflector of claim 6 further comprising a first reaction layer between the adhesive layer and the substrate.
8. The flip-chip light-emitting device with a micro-reflector of claim 6 further comprising a second reaction layer between the adhesive layer and the micro-reflector.
9. The flip-chip light-emitting device with a micro-reflector of claim 6 wherein the adhesive layer comprises a material selected from a material group consisting of adhesive, semiconductor, and transparent metal.
10. The flip-chip light-emitting device with a micro-reflector of claim 1 further comprising an insulating layer between the transparent patterned light-emitting stack layer and the reflective layer.
11. The flip-chip light-emitting device with a micro-reflector of claim 10 wherein the insulating layer comprises a material selected from a material group consisting of SiNx and SiO2.
12. The flip-chip light-emitting device with a micro-reflector of claim 1 further comprising a first electrode and a second electrode formed at a front side of the flip-chip light-emitting device, far from the substrate.
13. The flip-chip light-emitting device with a micro-reflector of claim 1 further comprising a first electrode formed at a front side of the flip-chip light-emitting device, and a second electrode formed at a side of the substrate far from the first electrode.
14. The flip-chip light-emitting device with a micro-reflector of claim 1 wherein the substrate comprises a material selected from a material group consisting of GaP, Sic, GaN, ZnSe, glass, and sapphire.
15. The flip-chip light-emitting device with a micro-reflector of claim 1 wherein the reflective layer comprises a material selected from a material group consisting of Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn, AuZn, and indium tin oxide.
16. The flip-chip light-emitting device with a micro-reflector of claim 1 wherein the substrate is connected to the micro-reflector with a direct wafer bonding.
17. The flip-chip light-emitting device with a micro-reflector of claim 1 wherein the shape of said plurality of concave surfaces is semicircular, pyramidical, or conical.
18. The flip-chip light-emitting device with a micro-reflector of claim 1 wherein the transparent patterned light-emitting stack layer is divided into a plurality of separated stack structures, and the transparent patterned light-emitting stack layer has a plurality of convex surfaces opposite to the substrate, with each separated stack structure forming one of the convex surfaces.