LED module and method of packaging the same
View Patent ↗An LED module and method of packing the same are provided. The LED module includes a substrate with at least one cavity therein, at least one LED unit positioned on portions of the substrate in the cavity, a circuit positioned above the LED unit and electrically connected to the LED unit, and a first capsulation material filling within the cavity.
1. A light emitting diode (LED) module, comprising:
a substrate, the substrate comprising at least one cavity;
at least one LED unit disposed on portions of the substrate in the cavity, wherein the LED unit comprises an LED chip, a thermal conductive layer disposed below the LED chip, an electrical conductive layer electrically connected to the LED chip, and an insulating layer positioned between the electrical conductive layer and the thermal conductive layer;
a circuit positioned above the LED unit and electrically connected to the LED unit; and
a first capsulation material layer filled within the cavity.
2. The LED module of claim 1 , wherein the LED unit further comprises at least one wire for connecting the LED chip to the electrical conductive layer.
3. The LED module of claim 1 , wherein the LED unit further comprises a second capsulation material layer covering the LED chip.
4. The LED module of claim 3 , wherein the second capsulation material layer is selected from the group consisting of a silica gel layer, a glass layer, a ceramic layer, or a composite layer comprised of silica gel, glass, or ceramics.
5. The LED module of claim 3 , wherein the surface of the second capsulation material layer is at the same level as the top surface of the electrical conductive layer.
6. The LED module of claim 1 , wherein the circuit comprises an opening for exposing the LED chip.
7. The LED module of claim 1 , wherein the circuit comprises a printed circuit board or other circuit designs.
8. The LED module of claim 1 , wherein the substrate comprises a radiating substrate.
9. The LED module of claim 1 , wherein the substrate is selected from the group consisting of a radiating fin, a radiating pipe, or an active cooling device.
10. The LED module of claim 1 , wherein the first capsulation material layer is selected from the group consisting of epoxy, spin-on glass (SOG), polyimide, B-staged bisbenzocyclobutene, ceramics, and glass.
11. A packaging method of an LED module, comprising:
providing a substrate, the substrate comprising at least one cavity;
disposing at feast one LED unit on portions of the substrate in the cavity, wherein the LED unit comprises an LED chip, a thermal conductive layer disposed below the LED chip, an electrical conductive layer electrically connected to the LED chip, and an insulating layer positioned between the electrical conductive layer and the thermal conductive layer;
soldering a circuit above the LED unit; and
tilling a first capsulation material layer within the cavity.
12. The packaging method of claim 11 , wherein the LED unit further comprises at least one wire for connecting the LED chip to the electrical conductive layer.
13. The packaging method of claim 11 , wherein the LED unit further comprises a second capsulation material layer covering the LED chip.
14. The packaging method of claim 13 , wherein the second capsulation material layer is selected from the group consisting of a silica gel layer, a glass layer, a ceramic layer, or a composite layer comprised of silica gel, glass, or ceramics.
15. The packaging method of claim 13 , wherein the surface of the second capsulation material layer is even with the top surface of the electrical conductive layer.
16. The packaging method of claim 11 , wherein the circuit comprises an opening for exposing the LED chip.
17. The packaging method of claim 11 , wherein the circuit comprises a printed circuit board or other circuit designs.
18. The packaging method of claim 11 , wherein the substrate comprises a radiating substrate.
19. The packaging method of claim 11 , wherein the substrate is selected from the group consisting of a radiating fin, a radiating pipe, or an active cooling device.
20. The packaging method of claim 11 , wherein the first capsulation material layer is selected from the group consisting of epoxy, spin-on glass (SOG), polyimide, B-staged bisbenzocyclobutene, ceramics, and glass.