IP Library Granted Patent US 7,310,240
Granted Patent B2
US 7,310,240 · App. 10/907,420 · Granted Dec 18, 2007

Method for increasing stability of system memory through enhanced quality of supply power

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,310,240
App. No.
10/907,420
Granted
Dec 18, 2007
Kind
B2
Abstract

An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.

Claims (21)

1. An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard, the apparatus comprising:

a printed circuit board;

a connector on the printed circuit board, the connector being configured to fit into a first expansion slot of the expansion slots on the motherboard, the connector having multiple pins comprising at least one power pin and at least one ground pin that define at least a first pair of power and ground pins, the connector being configured so that the power pin of the first pair of power and ground pins is connected to the supply power when the connector is received in the first expansion slot; and

at least one capacitor mounted to the printed circuit board and electrically connected to the first pair of power and ground pins of the connector, the at least one capacitor having a capacitance sufficient to buffer power transients within the supply power supplied to the expansion slots.

2. The apparatus according to claim 1 , wherein the first expansion slot for which the connector is configured is a memory expansion slot of the motherboard.

3. The apparatus according to claim 2 , wherein the at least one capacitor is an electrolytic capacitor.

4. The apparatus according to claim 2 , wherein the at least one capacitor is a tantalum capacitor.

5. The apparatus according to claim 1 , wherein the at least one capacitor is one of a plurality of capacitors on the printed circuit board and the first pair of power and ground pins is one of a plurality of pairs of power and ground pins defined by the multiple pins of the connector, each of the capacitors being electrically connected to a pair of the plurality of pairs of power and ground pins.

6. The apparatus according to claim 1 , wherein multiple capacitors are electrically connected to the first pair of cower and ground pins.

7. The apparatus according to claim 6 , wherein at least two of the multiple capacitors have different capacitances and cooperate to buffer relatively larger transients and relatively smaller faster transients.

8. An apparatus comprising:

a motherboard comprising expansion slots to which supply power is supplied by a bus on the motherboard;

expansion cards inserted into at least some of the expansion slots and powered by the bus through the expansion slots;

a printed circuit board inserted into at least a first expansion slot of the expansion slots, the printed circuit board having a connector engaged with the first expansion slot, the connector having multiple pins comprising at least one power pin and at least one ground pin that define at least a first pair of power and ground pins, the power pin of the first pair of power and ground pins being connected to the supply power; and

at least one capacitor mounted to the printed circuit board and electrically connected to the first pair of power and ground pins of the connector, the at least one capacitor having a capacitance sufficient to buffer power transients within the supply power supplied to the expansion slots.

9. The apparatus according to claim 8 , wherein the first expansion slot into which the connector is inserted is a memory expansion slot.

10. The apparatus according to claim 9 , wherein the at least one capacitor is an electrolytic capacitor.

11. The apparatus according to claim 9 , wherein the at least one capacitor is a tantalum capacitor.

12. The apparatus according to claim 8 , wherein the at least one capacitor is one of a plurality of capacitors on the printed circuit board and the first pair of power and ground pins is one of a plurality of pairs of power and ground pins defined by the multiple pins of the connector, each of the capacitors being electrically connected to a pair of the plurality of pairs of power and ground pins.

13. The apparatus according to claim 8 , wherein multiple capacitors are electrically connected to the first pair of power and ground pins.

14. The apparatus according to claim 13 , wherein at least two of the multiple capacitors have different capacitances and cooperate to buffer relatively larger transients and relatively smaller faster transients.

Assignments (15)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2017
From: TOSHIBA CORPORATION
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043620/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2016
From: OCZ STORAGE SOLUTIONS, INC.
To: TOSHIBA CORPORATION
Reel/Frame 038434/0371 →
RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 030092/0739) Recorded Apr 8, 2014
From: HERCULES TECHNOLOGY GROWTH CAPITAL, INC.
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 032640/0284 →
RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 031611/0168) Recorded Apr 8, 2014
From: COLLATERAL AGENTS, LLC
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 032640/0455 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE AND ATTACH A CORRECTED ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 032365 FRAME 0920. ASSIGNOR(S) HEREBY CONFIRMS THE THE CORRECT EXECUTION DATE IS JANUARY 21, 2014. Recorded Mar 18, 2014
From: OCZ TECHNOLOGY GROUP, INC.
To: TAEC ACQUISITION CORP.
Reel/Frame 032461/0486 →
CHANGE OF NAME Recorded Feb 27, 2014
From: TAEC ACQUISITION CORP.
To: OCZ STORAGE SOLUTIONS, INC.
Reel/Frame 032365/0945 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2014
From: OCZ TECHNOLOGY GROUP, INC.
To: TAEC ACQUISITION CORP.
Reel/Frame 032365/0920 →
SECURITY AGREEMENT Recorded Nov 11, 2013
From: OCZ TECHNOLOGY GROUP, INC.
To: COLLATERAL AGENTS, LLC
Reel/Frame 031611/0168 →
SECURITY AGREEMENT Recorded Mar 27, 2013
From: OCZ TECHNOLOGY GROUP, INC.
To: HERCULES TECHNOLOGY GROWTH CAPITAL, INC.
Reel/Frame 030092/0739 →
RELEASE OF SECURITY INTEREST Recorded Mar 26, 2013
From: WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 030088/0443 →
SECURITY AGREEMENT Recorded May 14, 2012
From: OCZ TECHNOLOGY GROUP, INC.
To: WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT
Reel/Frame 028440/0866 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2005
From: PETERSEN, RYAN M.
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 016047/0500 →