Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that heat dissipation is fast and yellowing of the encapsulating material is retarded.
1. A light module, comprising:
a substrate;
at least one light-emitting element on the substrate;
a sealing cap on the substrate and covering the light-emitting elements; and
a fluid in a space formed among the sealing cap, the light-emitting elements, and the substrate, wherein the fluid further comprises wavelength-converting material particles, diffuser particles, or anti-UV agents.
2. The light module of claim 1 , wherein the light module comprises a plurality of light-emitting elements on the substrate and the light-emitting elements are light-emitting diode chips electrically connected to each other.
3. The light module of claim 2 , wherein the light-emitting diode chips comprise a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip.
4. The light module of claim 1 , wherein the light module comprises a plurality of light-emitting elements on the substrate and the light-emitting elements are light-emitting diode package bodies electrically connected to each other.
5. The light module of claim 4 , wherein the light-emitting diode package bodies comprise a red light-emitting diode package body, a green light-emitting diode package body, and a blue light-emitting diode package body.
6. The light module of claim 1 , wherein the fluid comprises a transparent fluid having properties of heat resistance and light resistance.
7. The light module of claim 6 , wherein the fluid comprises silicone oil.
8. The light module of claim 1 , wherein the substrate has heat conductivity.
9. The light module of claim 1 , wherein the sealing cap comprises transparent material.
10. The light module of claim 1 , wherein the sealing cap comprises a single material layer or a composite material layer formed from one or more selected from the group consisting of silica gel, glass, ceramics, epoxy resin, polyimide, and B-staged bisbenzocyclobutene polymer.
11. The light module of claim 1 , wherein the substrate has a recess, and the light-emitting element is positioned on the recess.
12. The light module of claim 4 , wherein the light-emitting package bodies each have a capsulation material layer.
13. The light module of claim 12 , wherein the capsulation material layer comprises a single material layer or a composite material layer formed from one or more selected from the group consisting of silica gel, glass, ceramics, epoxy resin, polyimide, and B-staged bisbenzocyclobutene polymer.
14. A light module, comprising:
a substrate;
a plurality of light-emitting diode package bodies on the substrate, wherein the light-emitting diode package bodies are electrically connected to each other;
a sealing cap on the substrate and covering the light-emitting elements; and
a fluid in a space formed among the sealing cap, the light-emitting elements, and the substrate.
15. The light module of claim 14 , wherein the light-emitting diode package bodies comprise a red light-emitting diode package body, a green light-emitting diode package body, and a blue light-emitting diode package body.
16. The light module of claim 14 , wherein the fluid comprises a transparent fluid having properties of heat resistance and light resistance.
17. A light module, comprising:
a substrate;
a plurality of light-emitting elements on the substrate and the light-emitting elements are light-emitting diode package bodies electrically connected to each other;
a sealing cap on the substrate and covering the light-emitting elements; and
a fluid in a space formed among the sealing cap, the light-emitting elements, and the substrate,
wherein the substrate has a recess, and the light-emitting element is positioned on the recess.