Eliminating ESD exposure for read/write head with heating element
View Patent ↗Embodiments of the present invention provide a grounded conductive layer between the heater and the lower magnetoresistive (MR) shield in the read/write head structure. The grounded conductive layer eliminates or at least substantially prevents the accumulation of charges on the lower MR shield as a result of the voltage supplied to the heater. In one embodiment, a magnetic head comprises a plurality of read/write components; a heater disposed near the plurality of read/write components; and a grounded conductive layer disposed between the heater and the plurality of read/write components.
1. A magnetic head comprising:
a plurality of read/write components;
a heater disposed near the plurality of read/write components; and
a grounded conductive layer disposed between the heater and the plurality of read/write components.
2. The magnetic head of claim 1 wherein the grounded conductive layer is encapsulated in an insulating material and spaced between the heater and the plurality of read/write components, and wherein the grounded conductive layer is not exposed on the same side as the surface with the air bearing surface of the magnetic head.
3. The magnetic head of claim 1 wherein the grounded conductive layer comprises copper.
4. The magnetic head of claim 1 wherein the grounded conductive layer is at least as large in planar dimension as the heater to block influence of the heater on the read/write components.
5. The magnetic head of claim 1 wherein the grounded conductive layer has a thickness of about 50–200 nm.
6. The magnetic head of claim 1 wherein the plurality of read/write components comprise a magnetoresistive read assembly having a first shield, a second shield, and a magnetoresistive sensing member disposed between the first shield and the second shield; and wherein the grounded conductive layer is disposed between the heater and the first magnetic shield.
7. The magnetic head of claim 1 wherein the plurality of read/write components comprise:
a magnetoresistive read assembly having a first shield, a second shield, and a magnetoresistive sensing member disposed between the first shield and the second shield, which are exposed on the same side as a surface with an air bearing surface of the magnetic head; and
an inductive write assembly having a first pole piece and a second pole piece, which are exposed at the air bearing surface.
8. The magnetic head of claim 1 wherein the heater is encapsulated in an insulating material and spaced from the plurality of read/write components, and wherein the heater is not exposed on the same side as a surface with an air bearing surface of the magnetic head.
9. The magnetic head of claim 1 wherein the heater has a ground end and the grounded conductive layer is connected to the ground end of the heater.
10. A magnetic disk drive comprising:
a slider supported for movement relative to a magnetic disk; and
a magnetic head attached to the slider and having an air bearing surface facing the magnetic disk, the magnetic head including a plurality of magnetic head components for reading from or writing to the magnetic disk, a heater disposed near the plurality of magnetic head components, and a first grounded conductive layer disposed between the heater and the plurality of magnetic head components.
11. The magnetic disk drive of claim 10 wherein the first grounded conductive layer is encapsulated in an insulating material and spaced between the heater and the plurality of magnetic head components, and wherein the first grounded conductive layer is not exposed on the same side as a surface with the air bearing surface of the magnetic head.
12. The magnetic disk drive of claim 10 wherein the first grounded conductive layer is at least as large in planar dimension as the heater to block influence of the heater on the magnetic head components.
13. The magnetic disk drive of claim 10 wherein the plurality of magnetic head components comprise a magnetoresistive read assembly having a first shield, a second shield, and a magnetoresistive sensing member disposed between the first shield and the second shield; and wherein the first grounded conductive layer is disposed between the heater and the first magnetic shield.
14. The magnetic disk drive of claim 10 wherein the plurality of magnetic head components comprise:
a magnetoresistive read assembly having a first shield, a second shield, and a magnetoresistive sensing member disposed between the first shield and the second shield, which are exposed on the same side as a surface with the air bearing surface of the magnetic head; and
an inductive write assembly having a first pole piece and a second pole piece, which are exposed on the same side as the surface with the air bearing surface.
15. The magnetic disk drive of claim 10 wherein the heater is encapsulated in an insulating material and spaced from the plurality of magnetic head components, and wherein the heater is not exposed on the same side as a surface with the air bearing surface of the magnetic head.
16. The magnetic disk drive of claim 10 further comprising a second grounded conductive layer disposed between the heater and the slider.
17. The magnetic disk drive of claim 16 wherein the second grounded conductive layer is encapsulated in an insulating material and spaced between the heater and the slider, and wherein the second grounded conductive layer is not exposed on the same side as a surface with the air bearing surface of the magnetic head.
18. The magnetic disk drive of claim 16 wherein the second grounded conductive layer is at least as large in planar dimension as the heater to block influence of the heater on the slider.
19. A magnetic head comprising:
a magnetoresistive read assembly having a first shield, a second shield, and a magnetoresistive sensing member disposed between the first shield and the second shield, which are exposed on the same side as a surface with an air bearing surface of the magnetic head;
a heater disposed near the first shield of the magnetoresistive read assembly; and
a grounded conductive layer disposed between the heater and the first shield of the magnetoresistive read assembly.
20. The magnetic head of claim 19 wherein the grounded conductive layer is encapsulated in an insulating material and spaced between the heater and the first shield of the magnetoresistive read assembly, and wherein the grounded conductive layer is not exposed on the same side as a surface with the air bearing surface of the magnetic head.
21. The magnetic head of claim 19 wherein the grounded conductive layer is at least as large in planar dimension as the heater to block influence of the heater on the first shield of the magnetoresistive read assembly.