Substrate frame
View Patent ↗A substrate frame includes an insulative board ( 10 a ) having a pair of ear portions ( 13 ) extending along its longitudinal edges; a plurality of wiring substrate regions ( 11 ) arranged on the insulative board ( 10 a ) between the ear portions ( 13 ) at predetermined intervals; and a plurality of slits ( 15 ) provided between the wiring substrate regions so as to extend across the ear portions ( 13 ) or a plurality grooves ( 18 ) around the wiring substrate regions ( 11 ).
1. A method of making semiconductor devices, comprising the steps of:
providing an insulative board having a pair of ear portions extending along its longitudinal edges;
arranging a plurality of wiring substrate regions on said insulative board between said ear portions at predetermined intervals;
mounting semiconductor chips on said wiring substrate regions;
connecting pads of said wiring substrate regions and pads of said semiconductor chips;
enclosing said semiconductor chips with a resin; and
cutting boundaries between said wiring substrate regions and said ear portions to provide individual semiconductor devices.
2. A method of making semiconductor devices, comprising the steps of:
providing an insulative board having a pair of ear portions extending along its longitudinal edges;
a plurality of wiring substrate regions arranged on said insulative board between said ear portions at predetermined intervals;
providing a plurality of grooves around said wiring substrate regions from which patterns are removed;
mounting semiconductor chips on said wiring substrate regions;
connecting pads of said wiring substrate regions and pads of said semiconductor chips;
enclosing said semiconductor chips with a resin; and
cutting said grooves with a mold punch to provide individual semiconductor devices.