Polyamide adhesive and articles including the same
View Patent ↗A hot melt adhesive composition that includes thermoplastic polyamide, adhesion promoter that includes at least one acid group, and wax having a melting point greater than 82° C.
1. A hot melt adhesive composition comprising:
thermoplastic polyamide;
alkylene acrylic acid copolymer; and
wax having a melting point greater than 82° C.
2. The adhesive composition of claim 1 , comprising from about 70% by weight to about 90% by weight said polyamide.
3. The adhesive composition of claim 1 , comprising from about 65% by weight to about 95% by weight said polyamide.
4. The adhesive composition of claim 1 , wherein said polyamide has an amine number of at least 2.
5. The adhesive composition of claim 1 , wherein said polyamide has an amine plus acid number of at least 2 mg KOH/g.
6. The adhesive composition of claim 1 , wherein said polyamide has an amine plus acid number no greater than about 30 mg KOH/g.
7. The adhesive composition of claim 1 , wherein said polyamide has a weight average molecular weight of from about 6000 to about 30,000.
8. The adhesive composition of claim 1 , wherein said polyamide has a weight average molecular weight of from about 8000 to about 25,000.
9. The adhesive composition of claim 1 , wherein said polyamide has a weight average molecular weight of from greater than 12,000 to about 15,000.
10. The adhesive composition of claim 1 , wherein said alkylene acrylic acid copolymer is ethylene acrylic acid
11. The adhesive composition of claim 1 , comprising from 5% by weight to about 30% by weight said alkylene acrylic acid copolymer.
12. The adhesive composition of claim 1 , comprising from about 10% by weight to about 30% by weight said alkylene acrylic acid copolymer.
13. The adhesive composition of claim 1 , comprising from about 10% by weight to about 20% by weight said alkylene acrylic acid copolymer.
14. The adhesive composition of claim 1 , wherein said wax comprises a Fischer-Tropsch wax.
15. The adhesive composition of claim 1 , wherein said wax comprises mycrocrystalline wax.
16. The adhesive composition of claim 1 , comprising from greater than 3% by weight to about 7% by weight said wax.
17. The adhesive composition of claim 1 , comprising from about 4% by weight to about 6% by weight said wax.
18. The adhesive composition of claim 1 , wherein said adhesive composition forms a fiber tearing bond when bonded to a metallized polyester substrate.
19. The adhesive composition of claim 1 , wherein said adhesive composition, when coated on a metallized polyester substrate, maintains a fiber tearing bond to the metallized polyester substrate after storage at −12° C. for 24 hours.
20. The adhesive composition of claim 1 , wherein said adhesive composition, when coated on a metallized polyester substrate, maintains a fiber tearing bond to the metallized polyester substrate after storage at 60° C. for 24 hours.
21. The adhesive composition of claim 1 , wherein said adhesive composition exhibits a viscosity of no greater than 6000 centipoise at 177° C.
22. The adhesive composition of claim 1 , wherein said adhesive composition exhibits a viscosity of no greater than 5000 centipoise at 177° C.
23. The adhesive composition of claim 1 , wherein said composition is non-blocking to a metallized polymer film.
24. The adhesive composition of claim 1 , wherein said composition is non-blocking to kraft.
25. The adhesive composition of claim 1 , further comprising antioxidant.
26. An article comprising:
a metallized polymer film; and
an adhesive composition bonded to said metallized film, said adhesive composition comprising
thermoplastic polyamide,
alkylene acrylic acid copolymer, and
wax having a melting point greater than 82° C.
27. The article of claim 26 , wherein said adhesive composition exhibits a fiber tearing bond to said metallized polymer film.
28. The article of claim 26 , wherein said adhesive composition is further bonded to kraft.
29. The article of claim 26 , wherein said adhesive composition is further bonded to a second metallized polymer film.
30. A hot melt adhesive composition comprising:
thermoplastic polyamide;
adhesion promoter comprising at least one acid group; and
wax having a melting point greater than 82° C.