Coated substrate with improved solar control properties

1 . A coated substrate comprising:

a. a substrate;

b. a first dielectric layer overlying the substrate having a total thickness greater than 290 Å;

c. a first infrared-reflective metal layer having a thickness ranging from 100 Å to 130 Å overlying the first dielectric layer;

d. a first primer layer selected from a titanium containing material, a zirconium containing material, an aluminum containing material, a hafnium containing material, a copper containing material, a niobium containing material, a tantalum containing material, a vanadium containing material, and an indium containing material having a thickness ranging from 0.5 Å to 60 Å overlying the first infrared-reflective metal layer;

e. a second dielectric layer overlying the first primer layer having a total thickness ranging from 680 Å to 800 Å;

f. a second infrared-reflective metal layer having a thickness ranging from 115 Å to 150 Å overlying the second dielectric layer;

g. a second primer layer selected from a titanium containing material, a zirconium containing material, an aluminum containing material, a hafnium containing material, a copper containing material, a niobium containing material, a tantalum containing material, a vanadium containing material, and an indium containing material having a thickness ranging from 0.5 Å to 60 Å overlying and in direct contact with the second infrared-reflective metal layer; and

h. a third dielectric layer having a total thickness ranging from 190 Å to 380 Å overlying the second primer layer, wherein there is no NiOx layer between the first infrared-reflective metal layer and the second dielectric layer or over the second infrared-reflective metal.

2 . The coated substrate according to claim 1 wherein the first, second, and third dielectric layer is a single film comprised of a material having a refractive index greater than or equal to 2 in the visible portion of the electromagnetic spectrum.

3 . The coated substrate according to claim 2 wherein first, second, and third dielectric layer is a single film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride and aluminum nitride as well as alloys and mixtures thereof.

4 . (canceled)

5 . (canceled)

6 . The coated substrate according to claim 1 , wherein the first dielectric layer comprises:

a major film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof overlying the substrate; and

a minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof overlying the major film.

7 . The coated substrate according to claim 6 , wherein the minor film is zinc oxide.

8 . The coated substrate according to claim 1 , wherein the second dielectric layer comprises:

a. a lower minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof overlying the first primer layer;

b. major film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, silicon nitride, aluminum nitride as well as alloys and mixtures thereof overlying the lower minor film of the second dielectric layer; and

c. an upper minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof overlying the major film.

9 . The coated substrate according to claim 8 wherein the lower minor film and/or the upper minor film comprise zinc oxide.

10 . The coated substrate according to claim 1 , wherein the third dielectric layer comprises:

a. a minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof overlying the second primer layer; and

b. a major film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof overlying the major film.

11 . The coated substrate according to claim 10 wherein the minor film comprises zinc oxide.

12 . The coated substrate according to claim 1 , wherein the first and second infrared-reflective metal layers are selected from gold, copper, silver, and alloys and mixtures thereof.

13 . The coated substrate according to claim 1 , wherein the substrate is glass.

14 . The coated substrate according to claim 1 , wherein when the coated substrate is placed in an insulating glass (IG) unit having a configuration as described in the following manner: an outboard light pane having a major surface made of 0.223 inch thick clear glass spaced 0.5 inch apart from and facing an inboard light pane made of clear glass having a nominal thickness of 0.223 inch; a space between the light panes filled with air; and the coating applied on the major surface of the outboard light pane nearest to and facing the inboard light pane; and the IG unit exhibits at least one of the following properties: Tvis of greater than or equal to 68.2%; Rvis (exterior) of less than or equal to 13.4%; Rvis (interior) of less than or equal to 13.9%; TSET of less than or equal to 32.5%; TSER (exterior) of greater than or equal to 29.1%; TSER (interior) of greater than or equal to 30.8%; SC of less than or equal to 0.43; SHGC of less than or equal to 0.38; LSG Ratio of greater than or equal to 1.84; and U-Value of less than or equal to 0.30 Btu/hr-ft2-° F.

15 . The coated substrate according to claim 1 , further comprising a protective overcoat overlying the third dielectric layer.

16 . A coated substrate comprising:

a. a glass substrate;

b. a first dielectric layer having a total thickness greater than 290 Å overlying the substrate comprising:

i. a layer of zinc stannate overlying the substrate; and

ii. a layer of zinc oxide overlying the layer of zinc stannate;

c. a first silver layer having a thickness ranging from 100 Å to 130 Å overlying the first dielectric layer;

d. a first layer of titanium containing material having a thickness ranging from 0.5 Å to 60 Å overlying the first silver layer;

e. a second dielectric layer having a thickness ranging from 680 Å to 800 Å overlying the first layer of titanium containing material comprising:

i. a layer of zinc oxide overlying the layer of titanium containing material;

ii. a layer of zinc stannate overlying the layer of zinc oxide; and

iii. a layer of zinc oxide overlying the layer of zinc stannate;

f. a second silver layer having a thickness ranging from 115 Å to 150 Å overlying the second dielectric layer;

g. a second layer of titanium containing material having a thickness ranging from 0.5 Å to 60 Å overlying and in contact with the second silver layer; and

h. a third dielectric layer having a thickness ranging from 190 Å to 380 Å overlying the second layer of titanium containing material comprising:

i. a layer of zinc oxide overlying the second layer of titanium containing material; and

ii. a layer of zinc stannate overlying the layer of zinc oxide of the third dielectric layer,

wherein there is no NiOx layer between the first infrared-reflective metal layer and the second dielectric layer or over the second infrared-reflective metal.

17 . The coated substrate according to claim 16 wherein when the coated substrate is placed in an insulating glass (IG) unit having a configuration as described in the following manner: an outboard light pane having a major surface made of 0.223 inch thick clear glass spaced 0.5 inch apart from and facing an inboard light pane made of clear glass having a nominal thickness of 0.223 inch; a space between the light panes filled with air; and the coating applied on the major surface of the outboard light pane nearest to and facing the inboard light pane; and the IG unit exhibits at least one of the following properties: Tvis of greater than or equal to 68.2%; Rvis (exterior) of less than or equal to 13.4%; Rvis (interior) of less than or equal to 13.9%; TSET of less than or equal to 32.5%; TSER (exterior) of greater than or equal to 29.1%; TSER (interior) of greater than or equal to 30.8%; SC of less than or equal to 0.43; SHGC of less than or equal to 0.38; LSG Ratio of greater than or equal to 1.84; and U-Value of less than or equal to 0.30 Btu/hr-ft2-° F.

18 . A method for making a coated substrate comprising:

a. depositing a first dielectric layer having a thickness greater than 290 Å over the substrate;

b. depositing a first infrared-reflective metal layer having a thickness ranging from 100 Å to 130 Å over the first dielectric layer;

c. depositing a first primer layer selected from a titanium containing material, -a zirconium containing material, an aluminum containing material, a hafnium containing material, a copper containing material, a niobium containing material, a tantalum containing material, a vanadium containing material, and an indium containing material having a thickness ranging from 0.5 Å to 60 Å over the first infrared-reflective metal layer;

d. depositing a second dielectric layer having a thickness ranging from 680 Å to 800 Å over the first primer layer;

e. depositing a second infrared-reflective metal layer having a thickness ranging from 115 Å to 150 Å over the second dielectric layer;

f. depositing a second primer layer selected from a titanium containing material, a zirconium containing material, an aluminum containing material, a hafnium containing material, a copper containing material, a niobium containing material, a tantalum containing material, a vanadium containing material, and an indium containing material having a thickness ranging from 0.5 Å to 60 Å over and in direct contact with the second infrared-reflective metal layer; and

g. depositing a third dielectric layer having a thickness ranging from 190 Å to 380 Å over the second primer layer, wherein no NiOx layer is deposited between the first infrared-reflective metal layer and the second dielectric layer or over the second infrared-reflective metal.

19 . The method according to claim 18 wherein depositing the first dielectric layer comprises depositing a material having a refractive index greater than or equal to 2 in the visible portion of the electromagnetic spectrum.

20 . The method according to claim 18 wherein depositing the first dielectric layer comprises:

depositing a major film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof over the substrate; and

depositing a minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof over the major film.

21 . The method according to claim 20 wherein the deposited minor film is zinc oxide.

22 . The method according to claim 18 wherein depositing the second dielectric layer comprises:

a. depositing a lower minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof over the first primer film;

b. depositing a major film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof over the lower minor film; and

c. depositing an upper minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof over the major film.

23 . The method according to claim 22 wherein the deposited lower and upper minor film are comprised of zinc oxide.

24 . The method according to claim 18 wherein depositing the third dielectric layer over the second primer layer comprises:

a. depositing a minor film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof over the second primer layer; and

b. depositing a major film selected from zinc oxide, tin oxide, zinc/tin oxide, zinc stannate, zinc aluminum oxide, indium oxide, indium tin oxide, titanium oxide, tantalum oxide, bismuth oxide, silicon nitride, aluminum nitride as well as alloys and mixtures thereof over the minor film of the third dielectric layer.

25 . The method according to claim 24 wherein the deposited minor film is zinc oxide.

26 . The method of claim 18 further comprising heating the coated substrate.