Ink supply device
View Patent ↗An ink supply device comprising a molding of a settable material, the molding being a two-shot molding having a first part of a first material and a second part of a second material, wherein the first part comprises a plurality of collars of a hydrophobic, elastomeric compound which are configured to be sealingly and releasably engageable with respective ink filling formations of a set of filling formations of an ink reservoir, and the second part defines a number of ink chambers, each ink chamber adapted such that in use, the chamber is in fluid communication with a respective ink channel of one ink reservoir via one collar.
1. An ink supply device comprising a molding of a settable material, the molding being a two-shot molding having a first part of a first material and a second part of a second material, wherein the first part comprises a plurality of collars of a hydrophobic, elastomeric compound which are configured to be sealingly and releasably engageable with respective ink filling formations of a set of filling formations of an ink reservoir, and the second part defines a number of ink chambers, each ink chamber adapted such that in use, the chamber is in fluid communication with a respective ink channel of one ink reservoir via one collar.
2. An ink supply device as claimed in claim 1 , wherein the ink supply device is configured to be placed side-by-side in modular fashion with a plurality of like ink supply devices along an elongate ink reservoir.
3. An ink supply device as claimed in claim 2 , including a printhead chip and a tape automated bond (TAB) film connected to the printhead chip to drive the printhead chip, the printhead chip being configured so that, when the ink supply devices are positioned on the reservoir, the printhead chips define an array that spans the print area.