Print head nozzle formation
View Patent ↗Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
1. A print head body, comprising:
a main portion having a pumping chamber; and
a nozzle portion formed of silicon connected to the main portion, the nozzle portion having a nozzle inlet and a nozzle outlet, wherein the nozzle inlet has tapered walls centered around a central axis, the tapered walls lead to the nozzle outlet, the nozzle outlet has substantially straight walls within ±1° around the central axis and the nozzle inlet and nozzle outlet are substantially free of any surfaces that are orthogonal to the central axis.
2. The print head body of claim 1 , wherein the nozzle outlet has a substantially circular cross section.
3. The print head body of claim 1 , wherein the nozzle outlet has a substantially rectangular cross section.
4. The print head body of claim 1 , wherein the nozzle portion is about equal to or less than 100 microns thick.
5. The print head body of claim 4 , wherein the nozzle portion is about equal to or less than 60 microns.
6. A fluid ejection nozzle layer, comprising:
a body including silicon and having a recess with tapered walls, wherein the recess has a first thickness; and
an outlet, wherein the outlet is fluidly connected to the recess to form a through-hole, the walls of the outlet intersect with the tapered walls of the recess, the outlet has a second thickness and the first and second thickness together are about equal to or less than sixty microns.
7. The layer of claim 6 , wherein the outlet has substantially straight walls.
8. The layer of claim 6 , wherein the outlet has a substantially circular cross section.
9. The layer of claim 6 , wherein the outlet has a substantially rectangular cross section.
10. The layer of claim 6 , wherein the outlet has substantially straight walls within ±1°.
11. A fluid ejection device, comprising:
a passage in a semiconductor nozzle layer; and
a semiconductor substrate having a chamber, the substrate secured to a first surface of the nozzle layer such that the chamber is fluidly coupled to the atmosphere through the passage;
wherein the semiconductor nozzle layer is about equal to or less than 60 microns thick.
12. The fluid ejection device of claim 11 , wherein the passage has an inlet and an outlet, the inlet has tapered walls centered around a central axis, the tapered walls lead to the outlet, the outlet has substantially straight walls.
13. The fluid ejection device of claim 12 , wherein the outlet has substantially straight walls within ±1° around the central axis.
14. A print head body, comprising:
a main portion having a pumping chamber; and
a nozzle portion having a thickness of about equal to 60 microns or less and formed of silicon connected to the main portion, the nozzle portion having a nozzle inlet and a nozzle outlet, wherein the nozzle inlet has tapered walls centered around a central axis, the tapered walls lead to the nozzle outlet, the nozzle outlet has substantially straight walls and the nozzle inlet and nozzle outlet are substantially free of any surfaces that are orthogonal to the central axis.
15. The print head body of claim 14 , wherein the nozzle outlet has a substantially circular cross section, wherein the cross section is orthogonal to the central axis.
16. The print head body of claim 14 , wherein the nozzle outlet has a substantially rectangular cross section, wherein the cross section is orthogonal to the central axis.
17. The printhead body of claim 14 , wherein the nozzle outlet has substantially straight walls within ±1° around the central axis.