Interposer with integral heat sink
View Patent ↗An area array connector for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element is described. The area array connector includes at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element. The area array connector also includes at least one thermally conductive member adapted to provide thermal interconnection between the first circuit element and the second circuit element.
1. A connector assembly for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element, the connector assembly comprising:
an interposer having a first side for contacting the first circuit element and a second side for contacting the second circuit element;
at least one electrically conductive interconnector disposed within the interposer, the at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element;
a single thermally conductive member extending from the first side of the interposer to the second side of the interposer, the single thermally conductive member having a first surface exposed from the first side of the interposer for contact with the first circuit element and a second surface exposed from the second side of the interposer for contact with the second element, and the single thermally conductive member adapted to provide a conductive thermal interconnection between the first circuit element and the second circuit element; and
wherein the single thermally conductive member is arranged in a ring-type configuration to form a border around the interposer.
2. The connector assembly of claim 1 , wherein the single thermally conductive member comprises a heat sink.
3. The connector assembly of claim 1 , wherein the first circuit element comprises an integrated circuit package.
4. The connector assembly of claim 1 , wherein the second circuit element comprises a printed wiring board.
5. The connector assembly of claim 4 , wherein the printed wiring board comprises at least one thermal plane.
6. The connector assembly of claim 5 further comprising a pad adapted to facilitate transfer of heat from the single thermally conductive member to the thermal plane.
7. The connector assembly of claim 6 , wherein the pad comprises a solid metal plug connected to the thermal plane.
8. The connector assembly of claim 4 , wherein the second circuit element comprises at least one circuitry layer.
9. The connector assembly of claim 1 , wherein the interposer is comprised of a plurality of layers.
10. The connector assembly of claim 1 , wherein the single thermally conductive member includes a lip adapted to retain the single thermally conductive member within the interposer.
11. The connector assembly of claim 10 wherein the interposer includes a notch configured to receive the lip of the single thermally conductive member.
12. A connector assembly for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element, the connector assembly comprising:
an interposer having a first side for contacting the first circuit element and a second side for contacting the second circuit element, the interposer further having a single thermally conductive member integrally formed therewith and extending from the first side of the interposer to the second side of the interposer, the single thermally conductive member having a first surface exposed from the first side of the interposer for contact with the first circuit element and a second surface exposed from the second side of the interposer for contact with the second element, and the single thermally conductive member adapted to directly transfer thermal energy between the first circuit element and the second circuit element;
at least one electrically conductive interconnector disposed within the interposer, the at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element; and
wherein the single thermally conductive member is arranged in a ring-type configuration to form a border around the interposer.
13. The connector assembly of claim 12 , wherein the single thermally conductive member comprises a heat sink.
14. The connector assembly of claim 12 , wherein the first circuit element comprises an integrated circuit package.
15. The connector assembly of claim 12 , wherein the second circuit element comprises a printed wiring board.
16. The connector assembly of claim 15 , wherein the printed wiring board comprises at least one thermal plane.
17. The connector assembly of claim 16 further comprising a pad adapted to facilitate transfer of heat from the single thermally conductive member to the thermal plane.
18. The connector assembly of claim 17 , wherein the pad comprises a solid metal plug connected to the thermal plane.
19. The connector assembly of claim 15 , wherein the second circuit element comprises at least one circuitry layer.
20. The connector assembly of claim 12 , wherein the interposer is comprised of a plurality of layers.
21. The connector assembly of claim 12 , wherein the at single thermally conductive member includes a lip adapted to retain the single thermally conductive member within the interposer.
22. The connector assembly of claim 21 wherein the interposer includes a notch configured to receive the lip of the single thermally conductive member.