Light bulb having surfaces for reflecting light produced by electronic light generating sources
View Patent ↗The present light bulb uses electronic light generating sources and serves as a replacement for incandescent lamps or other lamps or so-called “light bulbs.” The light bulb is comprised of a plurality of individual light sources, such as light emitting diodes (LED's), capable of emitting white light or blue light or light of any other desired color. These light emitting elements are enclosed in an outer bulb housing that may include an optical tuning element and provided with the proper base for connection to a power source, e.g. a socket. The light bulb is characterized by a housing having a round top and a somewhat funnel-shaped side wall connected to the base. The side wall is constructed with the desired angle of taper in order to obtain the desired angle of dispersion of the light. The interior of the tapered portion is provided with a mirrored surface so as to reflect light in the interior of the bulb and thereby obtain a wide angle of dispersion. An inner peripheral row of LED's or other light sources is also provided so that additional backlight is reflected back into the interior of the bulb housing, reflect off of the mirrored surface and, thereafter, allowed to escape through the round top with a wide angle of dispersion. In addition, the optical tuning element may include reflective portions, opaque portions, and transparent portions to further provide functionality and means for adjusting the dispersion of the light emitted from the light bulb.
1. An apparatus comprising:
a housing having a portion that is transmissive to radiation within a waveband;
a substrate supported within said housing and having first and second sides, said substrate being transmissive to radiation within said waveband;
circuitry within said housing, said circuitry including first and second elements that are respectively supported on said first and second sides of said substrate and that can each emit radiation within said waveband, radiation emitted by said first element passing through said portion of said housing, and radiation emitted by said second element passing successively through said substrate and said portion of said housing; and
structure that facilitates a supply of electrical power to said circuitry within said housing.
2. An apparatus according to claim 1 , wherein said circuitry includes a plurality of said first elements disposed on said first side of said substrate, and a plurality of said second elements disposed on said second side of said substrate.
3. An apparatus according to claim 1 , wherein said first and second elements are each one of a light emitting diode and a laser diode.
4. An apparatus according to claim 1 , wherein said substrate is a circuit board.
5. An apparatus according to claim 1 , including reflective structure disposed within said housing, radiation emitted by said second element being reflected by said reflective structure and then passing successively through said substrate and said portion of said housing.
6. An apparatus according to claim 5 , wherein said reflective structure is provided on an inner surface portion of said housing.
7. An apparatus according to claim 6 , wherein said inner surface portion of said housing has an approximately frustoconical shape.
8. An apparatus according to claim 6 , wherein said inner surface portion of said housing has a flared shape.
9. An apparatus according to claim 6 , wherein said reflective structure includes a crystalline particulate material provided on said inner surface portion of said housing.
10. An apparatus according to claim 5 , including an insert supported within said housing, said reflective structure being provided on a side of said insert facing said substrate.
11. An apparatus according to claim 10 , wherein said side of said insert facing said substrate has approximately a semi-hemispherical shape.
12. An apparatus according to claim 10 , wherein said reflective structure includes a crystalline particulate material provided on said side of said insert facing said substrate.
13. An apparatus according to claim 1 , wherein said structure includes an electrical connector that is supported on said housing, that is electrically coupled to said circuitry, and that facilitates a supply of electrical power from externally of said housing to said circuitry within said housing.
14. An apparatus according to claim 1 , wherein said circuitry includes a semiconductor rectifier supported on said substrate.
15. An apparatus comprising:
a housing having a portion that is transmissive to radiation within a waveband;
a substrate supported within said housing and having first and second sides;
reflective structure disposed within said housing;
circuitry disposed within said housing, said circuitry including first and second elements that are respectively supported on said first and second sides of said substrate and that can each emit radiation within said waveband, radiation emitted by said first element traveling in a direction of travel from said first element to said portion of said housing and then passing through said portion of said housing in said direction of travel, and radiation emitted by said second element traveling to said reflective structure, said reflective structure reflecting the radiation from said second element, the reflected radiation thereafter passing through said portion of said housing approximately in said direction of travel; and
structure that facilitates a supply of electrical power to said circuitry within said housing;
wherein said substrate is transmissive to radiation within said waveband, and radiation emitted by said second element passes through said substrate.
16. An apparatus according to claim 15 , wherein the radiation reflected by said reflective structure passes successively through said substrate and said portion of said housing.
17. An apparatus according to claim 15 ,
wherein said substrate is a circuit board;
wherein the radiation traveling from said first element to said portion of said housing does not pass through said substrate; and
wherein the radiation traveling from said second element to said reflective structure does not pass through said substrate.
18. An apparatus according to claim 15 , wherein said circuitry includes a plurality of said first elements disposed on said first side of said substrate, and a plurality of said second elements disposed on said second side of said substrate.
19. An apparatus according to claim 15 , wherein said first and second elements are each one of a light emitting diode and a laser diode.
20. An apparatus according to claim 15 , wherein said reflective structure is provided on an inner surface portion of said housing.
21. An apparatus according to claim 20 , wherein said inner surface portion of said housing has an approximately frustoconical shape.
22. An apparatus according to claim 20 , wherein said inner surface portion of said housing has a flared shape.
23. An apparatus according to claim 20 , wherein said reflective structure includes a crystalline particulate material provided on said inner surface portion of said housing.
24. An apparatus according to claim 15 , including an insert supported within said housing, said reflective structure being provided on a side of said insert facing said substrate.
25. An apparatus according to claim 24 , wherein said side of said insert facing said substrate has approximately a semi-hemispherical shape.
26. An apparatus according to claim 24 , wherein said reflective structure includes a crystalline particulate material provided on said side of said insert facing said substrate.
27. An apparatus according to claim 15 , wherein said structure includes an electrical connector that is supported on said housing, that is electrically coupled to said circuitry, and that facilitates a supply of electrical power from externally of said housing to said circuitry within said housing.
28. An apparatus according to claim 15 , wherein said circuitry includes a semiconductor rectifier.
29. An apparatus according to claim 15 , wherein said substrate has a portion that is disposed between said first and second elements.
30. An apparatus according to claim 15 ,
wherein said radiation from said first element travels in said direction of travel from said first element to and through said portion of said housing; and
wherein said radiation from said second element travels from said second element to said reflective structure in a direction different from said direction of travel, and then travels in said direction of travel from said reflective structure to and through said portion of said housing.
31. A method comprising:
emitting radiation within a waveband from each of first and second elements respectively supported on first and second sides of a substrate that is within a housing and transmissive to radiation within said waveband;
causing radiation emitted by said first element to pass through a portion of said housing that is transmissive to radiation within said waveband;
causing radiation emitted by said second element to pass successively through said substrate and said portion of said housing.
32. A method according to claim 31 , including selecting as each of said first and second elements one of a light emitting diode and a laser diode.
33. A method according to claim 31 , including configuring said substrate as a circuit board.
34. A method according to claim 31 , including reflecting radiation emitted by said second element with reflective structure disposed within said housing, the reflected radiation passing successively through said substrate and said portion of said housing.
35. A method according to claim 34 , including configuring said reflective structure to include a crystalline particulate material.
36. A method comprising:
emitting radiation within a waveband from each of first and second elements respectively supported on first and second sides of a substrate disposed within a housing that has a portion transmissive to radiation within said waveband;
configuring said substrate to be transmissive to radiation within said waveband;
causing radiation emitted by said first element to travel in a direction of travel from said first element to said portion of said housing and to then pass through said portion of said housing in said direction of travel;
causing radiation emitted by said second element to travel to and be reflected by reflective structure disposed within said housing, the reflected radiation thereafter passing through said portion of said housing approximately in said direction of travel; and
causing radiation emitted by said second element to pass through said substrate.
37. A method according to claim 36 , including causing the reflected radiation to pass successively through said substrate and said portion of said housing.
38. A method according to claim 36 , including:
configuring said substrate as a circuit board;
causing the radiation emitted by said first element to travel from said first element to said portion of said housing along a route that does not pass through said substrate; and
causing the radiation emitted by said second element to travel from said second element to said reflective structure along a path does not pass through said substrate.
39. A method according to claim 36 , including selecting as each of said first and second elements one of a light emitting diode and a laser diode.
40. A method according to claim 36 , including configuring said reflective structure to include a crystalline particulate material.
41. A method according to claim 36 , including configuring said substrate to have a portion that is disposed between said first and second elements.
42. A method according to claim 36 , including:
causing said radiation from said first element to travel in said direction of travel from said first element to and through said portion of said housing; and
causing said radiation from said second element to travel from said second element to said reflective structure in a direction different from said direction of travel, and then to travel in said direction of travel from said reflective structure to and through said portion of said housing.