Methods for forming an undercut region and electronic devices incorporating the same
View Patent ↗An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.
1. A method for forming a solid layer within an undercut region of a substrate structure, wherein the method comprises:
forming a first electrode over a substrate;
forming a patterned protective layer over the first electrode;
forming the substrate structure over the patterned protective layer, wherein an opening within the substrate structure overlies an exposed portion of the patterned protective layer;
removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming the undercut region of the substrate structure;
depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer; and
solidifying the liquid to form the solid layer within the undercut region of the substrate structure;
wherein the patterned protective layer comprises a first metallic layer and a second metallic layer, wherein the first metallic layer contacts both the first electrode and the second metallic layer.
2. The method of claim 1 , wherein depositing the liquid is performed using a precision deposition technique.
3. The method of claim 1 , wherein the patterned protective layer comprises a silicon-containing molecule.
4. The method of claim 1 , wherein the patterned protective layer comprises an organic material.
5. The method of claim 1 , wherein another portion of the patterned protective layer remains over the substrate after removing the exposed portion of the patterned protective layer.
6. The method of claim 1 , wherein the solid layer within the undercut region of the substrate structure comprises an organic active layer.
7. An electronic device produced by the method of claim 1 .
8. The method of claim 1 , further comprising applying a surface treatment to the substrate structure prior to removal of the exposed portion of the patterned protective layer.
9. The method of claim 8 , wherein the surface treatment comprises fluorination.
10. The method of claim 1 , wherein the patterned protective layercomprises at least one element within Group 4, 5, 6, 8 10, 11, 12 ,13 or 14 of the Periodic Table, or any combination thereof.
11. The method of claim 10 , wherein the patterned protective layer comprises at least one element comprising Cu, Al, Ag, Au, Mo, Cr, Ti. Ta, W, Si, or any combination thereof.
12. The method of claim 1 , wherein the undercut region has a height of 0.1 microns to 1 micron and a depth of 0.1 microns to 10 microns.
13. The method of claim 12 , wherein the undercut region has a height of 0.4 microns to 1 micron and a depth of 0.5 microns to 10 microns.
14. A method for forming a solid layer within an undercut region of a substrate structure, wherein the method comprises:
forming a first electrode over a substrate;
forming a patterned protective layer over the first electrode;
forming the substrate structure over the patterned protective layer, wherein an opening within the substrate structure overlies an exposed portion of the patterned protective layer;
removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming the undercut region of the substrate structure;
depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer; and
solidifying the liquid to form the solid layer within the undercut region of the substrate structure;
wherein the patterned protective layer comprises a first and a second metallic layer, wherein the first metallic layer contacts both the first electrode and the second metallic layer.