IP Library Granted Patent US 7,191,508
Granted Patent B2
US 7,191,508 · App. 10/917,591 · Granted Mar 20, 2007

Method for manufacturing thin-film magnetic head sliders

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Quick Facts
Patent No.
US 7,191,508
App. No.
10/917,591
Granted
Mar 20, 2007
Kind
B2
Abstract

A method for manufacturing thin-film magnetic head sliders is disclosed. Initially, an elastic layer, which may be made of poly-dimethyl siloxane (PDMS), is spun on a wafer and is thermally cured. Then, a resist layer is spun on the elastic layer. Both the resist layer and the elastic layer are subsequently peeled off together from the wafer. Next, the peeled resist layer/elastic layer is applied onto a group of magnetic heads with the resist layer in direct contact with the magnetic heads. Finally, the elastic layer is peeled off from the resist layer such that the resist layer remains attaching to the magnetic heads.

Claims (14)

1. A method for coating an uniform resist layer onto a plurality of non-planar sliders, said method comprising:

spinning an elastic layer on a wafer;

curing said elastic layer;

spinning a resist layer on said elastic layer;

peeling said resist layer and said elastic layer together off from said wafer;

applying said peeled resist layer and elastic layer onto a plurality of magnetic heads with said resist layer in direct contact with said plurality of magnetic heads; and

peeling said elastic layer off from said resist layer such that said resist layer remains attaching to said plurality of magnetic heads.

2. The method of claim 1 , wherein said elastic layer is poly-dimethyl siloxane.

3. The method of claim 1 , wherein said resist layer is a positive tone resist layer.

4. The method of claim 1 , wherein said wafer is a silicon wafer.

5. The method of claim 1 , wherein said curing further includes curing said elastic layer at approximately 110 degree Celsius for about 8 minutes.

6. The method of claim 1 , wherein said applying further includes applying with a roller.

7. The method of claim 6 , wherein said applying further includes applying with a roller at approximately 25 degree Celsius and pressure at approximately 1 psi.

8. The method of claim 1 , wherein said method further includes baking said resist layer at a temperature between approximately 40 degree Celsius to 60 degree Celsius after said resist layer has been spun on said elastic layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2005
From: HWANG, CHERNGYE; LEE, KIM Y.; MCCLELLAND, GARY; MCKEAN, DENNIS RICHARD; REILEY, TIMOTHY CLARK
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 015570/0682 →