IP Library Granted Patent US 7,241,851
Granted Patent B2
US 7,241,851 · App. 10/918,608 · Granted Jul 10, 2007

Silicone condensation reaction

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Quick Facts
Patent No.
US 7,241,851
App. No.
10/918,608
Granted
Jul 10, 2007
Kind
B2
Abstract

A new silicone condensation reaction, the condensation between an alkoxy silane or siloxane or a dihydric phenol and an organo-hydrosilane or siloxane and catalysts therefore is described and claimed.

Claims (26)

1. A process for forming a silicon to oxygen bond comprising:

a) reacting a first silicon containing compound said first silicon containing compound comprising a hydrogen atom directly bonded to a silicon atom with

i) at least one compound comprising oxygen, said compound selected from the group consisting of alcohol, ester, aldehyde, ether, carbonate and combinations and mixtures thereof and

ii) a Lewis acid catalyst,

thereby forming a second silicon containing compound, said second silicon containing compound comprising an alkoxy group bonded to a silicon atom; and

b) reacting the formed second silicon containing compound comprising an alkoxy group bonded to a silicon atom with the residual first silicon containing compound thereby forming a silicon to oxygen bond, and

wherein said process is stabilized by the addition of a compound selected from the group consisting of ammonia, primary amines, secondary amines, tertiary amine and organophosphines.

2. The process of claim 1 wherein the Lewis acid catalyst comprises a compound of the formula:

MR 12 x X y

wherein M is selected from the group consisting of B, Al, Ga, In and Tl; each R 12 is independently selected from the group of monovalent aromatic hydrocarbon radicals having from 6 to 14 carbon atoms; X is a halogen atom selected from the group consisting of F, Cl, Br, and I; x is 1, 2, or 3; and y is 0, 1 or 2; subject to the requirement that x+y=3.

3. The process of claim 2 where M is boron.

4. The process claim 2 wherein each R 12 is C 6 F 5 and x=3.

5. The process of claim 1 wherein said process is activated by heat.

6. A process for forming a silicon to oxygen bond comprising:

a) reacting a first silicon containing compound said first silicon containing compound comprising a hydrogen atom directly bonded to a silicon atom with

i) at least one compound comprising oxygen, said compound selected from the group consisting of alcohol, ester, aldehyde, ether, carbonate and combinations and mixtures thereof and

ii) a Lewis acid catalyst, thereby forming a second silicon containing compound, said second silicon containing compound comprising an alkoxy group bonded to a silicon atom; and

b) reacting the formed second silicon containing compound comprising an alkoxy group bonded to a silicon atom with the residual first silicon containing compound thereby forming a silicon to oxygen bond, and

wherein the compound comprising oxygen is an ether.

7. The process of claim 6 wherein the ether is diethylether.

8. A process for forming a silicon to oxygen bond comprising:

a) reacting a first silicon containing compound said first silicon containing compound comprising a hydrogen atom directly bonded to a silicon atom with

i) at least one compound comprising oxygen, said compound selected from the group consisting of alcohol, ester, aldehyde, ether, carbonate and combinations and mixtures thereof and

ii) a Lewis acid catalyst having the formula B(C 6 F 5 ) 3 , thereby forming a second silicon containing compound, said second silicon containing compound comprising an alkoxy group bonded to a silicon atom; and

b) reacting the formed second silicon containing compound comprising an alkoxy group bonded to a silicon atom with the residual first silicon containing compound thereby forming a silicon to oxygen bond, and

wherein the compound comprising oxygen is an ether.

Assignments (1)
RELEASE OF SECURITY INTEREST Recorded Nov 11, 2020
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MOMENTIVE PERFORMANCE MATERIALS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH & CO KG; MOMENTIVE PERFORMANCE MATERIALS JAPAN HOLDINGS GK
Reel/Frame 054387/0001 →