Method of manufacturing a stackable ball grid array
View Patent ↗A method of manufacturing a stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a preformed packages which have alignment features to allow for the stacking of the ball grid arrays. The alignment features are used to align and orient each package with respect to an adjacent package, substrate or printed circuit board. The alignment features also support the weight of the adjacent package during solder ball reflow to maintain stack height and parallelism between packages. Each memory device is serially connected to the adjacent memory device through the vias and solder balls on each package.
1. A method of manufacturing a memory package comprising:
stacking a plurality of ball grid arrays vertically, wherein each of the plurality of ball grid arrays comprises a package comprising a die side having a first plurality of non-metal mateable alignment features and a ball side having a second plurality of non-metal mateable alignment features:
coupling each of a plurality of memory chips to the die side of a respective one of
the plurality of packages to form the plurality of ball arid arrays; and
coupling each of the plurality of ball grid arrays to another of the plurality of ball grid arrays.
2. The method of manufacturing, as set forth in claim 1 , wherein each of the plurality of ball grid arrays comprises a molded resin body having the die side and the ball side.
3. The method of manufacturing, as set forth in claim 1 , wherein the plurality of first mateable alignment features are male and the plurality of second mateable alignment features are female.
4. The method of manufacturing, as set forth in claim 1 , wherein the plurality of first mateable alignment features are male and the plurality of second mateable alignment features are male.
5. The method manufacturing, as set forth in claim 1 , wherein the plurality of first mateable alignment features are female and the plurality of second mateable alignment features are male.
6. The method of manufacturing, as set forth in claim 1 , wherein the plurality of first mateable alignment features are female and the plurality of second mateable alignment features are female.
7. The method of manufacturing, as set forth in claim 1 , arranging adjacent ball grid arrays in a unique orientation with respect to one another by aligning the plurality of first mateable alignment features and the plurality of second mateable alignment features.
8. The method of manufacturing, as set forth in claim 7 , wherein the plurality of first mateable alignment features and the plurality of second mateable alignment features are arranged asymmetrically.
9. The method of manufacturing, as set forth in claim 7 , wherein the plurality of first mateable alignment features and the plurality of second mateable alignment features comprise at least one unique alignment feature.
10. The method of manufacturing, as set forth in claim 1 , comprising supporting adjacent ball grid arrays during solder ball reflow with the plurality of first mateable alignment features and the plurality of second mateable alignment features.
11. The method of manufacturing, as set forth in claim 1 , comprising electrically coupling each of the plurality of ball grid arrays to another of the plurality of ball grid arrays using solder balls.
12. The method of manufacturing, as set forth in claim 11 , wherein each of the plurality of bail grid arrays comprise vias extending therethrough to electrically connect solder balls of adjacent memory packages serially.
13. A method of assembly comprising:
operatively coupling a chip to a package, the package comprising:
a die side;
a ball side configured to receive a plurality of conductive balls;
a plurality of first non-metal mateable alignment features on the die side of the package; and
a plurality of second non-metal mateable alignment features on the ball side of the package; and
stacking a second package on the first package such that the plurality of first mateable alignment features on the first package is mateably coupled to the second package.
14. The method of assembly, as set forth in claim 13 , the second package comprising:
a die side;
a ball side configured to receive a plurality of conductive balls;
a plurality of first non-metal mateable alignment features on the die side of the package; and
a plurality of second non-metal mateable alignment features on the ball side of the package; and
wherein stacking the second package comprises stacking the second package on the first package such that the plurality of first mateable alignment features on the first package is mateably coupled to the plurality of second mateable alignment features on the second package.
15. The method of assembly, as set forth in claim 13 , wherein each of the first and second packages comprises a molded resin body.
16. The method of assembly, as set forth in claim 13 , wherein the plurality of first non-metal mateable alignment features are male and the plurality of second non-metal mateable alignment features are female.
17. The method of assembly, as set forth in claim 13 , wherein the plurality of first non-metal mateable alignment features are male and the plurality of second non-metal mateable alignment features are male.
18. The method of assembly, as set forth in claim 13 , wherein the plurality of first non-metal mateable alignment features are female and the plurality of second non-metal mateable alignment features are male.
19. The method of assembly, as set forth in claim 13 , wherein the plurality of first non-metal mateable alignment features are female and the plurality of second non-metal mateable alignment features are female.
20. The method of assembly, as set forth in claim 13 , wherein the chip comprises a memory chip.
21. The method of assembly, as set forth in claim 13 , wherein the plurality of first non-metal mateable alignment features and the plurality of second non-metal mateable alignment features are arranged asymmetrically.
22. A method of manufacturing a package comprising:
providing a first package having a die side comprising a plurality of first non-metal mateable alignment features and wherein the die side is configured to receive a die, the first package further having a ball side comprising a plurality of second non-metal mateable alignment features and wherein the ball side is configured to receive a plurality of conductive balls;
operatively coupling a first die to the die side of the first package:
providing a second package having a die side comprising a plurality of first non-metal mateable alignment features and wherein the die side is configured to receive a die, the second package further having a ball side comprising a plurality of second non-metal mateable alignment features and wherein the ball side is configured to receive a plurality of conductive balls;
operatively coupling a second die to the die side of the second package; and
coupling the first package to the second package.
23. The method of manufacturing, as set forth in claim 22 , wherein the package comprises a molded resin body.
24. The method of manufacturing, as set forth in claim 22 , wherein the plurality of first non-metal mateable alignment features are male and the plurality of second non-metal mateable alignment features are female.
25. The method of manufacturing, as set forth in claim 22 , wherein the plurality of first non-metal mateable alignment features are male and the plurality of second non-metal mateable alignment features are male.
26. The method of manufacturing, as set forth in claim 22 , wherein the plurality of first non-metal mateable alignment features are female and the plurality of second non-metal mateable alignment features are male.
27. The method of manufacturing, as set forth in claim 22 , wherein the plurality of first non-metal mateable alignment features are female and the plurality of second non-metal mateable alignment features are female.
28. The method of manufacturing, as set forth in claim 22 , wherein the plurality of first non-metal mateable alignment features and the plurality of second non-metal mateable alignment features orient adjacent packages in a unique location.
29. The method of manufacturing, as set forth in claim 28 , wherein the plurality of first non-metal mateable alignment features and the plurality of second non-metal mateable alignment features are arranged asymmetrically.
30. The method of manufacturing, as set forth in claim 28 , wherein the plurality of first non-metal mateable alignment features and the plurality of second non-metal mateable alignment features comprise at least one unique alignment feature.
31. The method of manufacturing, as set forth in claim 22 , comprising supporting adjacent packages during solder ball reflow with the plurality of first non-metal mateable alignment features and the plurality of second non-metal mateable alignment features.
32. The method of manufacturing, as set forth in claim 22 , comprising arranging the plurality of first non-metal mateable alignment features and the plurality of second non-metal mateable alignment features asymmetrically.