IP Library Granted Patent US 6,988,792
Granted Patent B2
US 6,988,792 · App. 10/921,319 · Granted Jan 24, 2006

Multi-nozzle ink jet head

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Quick Facts
Patent No.
US 6,988,792
App. No.
10/921,319
Granted
Jan 24, 2006
Kind
B2
Abstract

A multi-nozzle ink jet head formed through semiconductor processes. The multi-nozzle head has a head substrate in which are formed a plurality of nozzles and a plurality of pressure chambers, a diaphragm that acts as a common electrode and covers the plurality of pressure chambers, piezoelectric body layers that are provided in correspondence with the pressure chambers on the diaphragm, and individual electrode layers that are provided on the piezoelectric body layers and have individual electrode parts corresponding to the pressure chambers and wiring parts for the individual electrode parts. By interposing a low-dielectric-constant layer or an insulating layer in the region of the wiring parts, or not disposing the common electrode in the region of the wiring parts, the electrical capacitance of the driving parts is reduced, and hence a driving lag is prevented from occurring, and moreover unwanted vibration of the piezoelectric bodies is prevented.

Claims (7)

1. A multi-nozzle ink jet head having a plurality of nozzles that eject ink, comprising:

a head substrate in which are formed said plurality of nozzles and a plurality of pressure chambers;

a common electrode acting as a diaphragm and which covers said plurality of pressure chambers;

piezoelectric body layers that are provided in correspondence with said pressure chambers on said common electrode;

individual electrode layers that are provided on said piezoelectric body layers and have individual electrode parts corresponding to said pressure chambers and wiring parts for said individual electrode parts; and

a low-dielectric layer or an insulating layer that is provided between said piezoelectric body layers and said common electrode in a region of said wiring parts.

2. The multi-nozzle ink jet head according to claim 1 , wherein said low-dielectric layer or insulating layer is constituted from a flattening layer provided in a part where the piezoelectric body layers are removed.