Method of forming metal fine particle pattern and method of forming electroconductive pattern

1. A method of forming a metal particle pattern, comprising:

forming a polymerization initiation layer on a support, the polymerization initiation layer comprising copolymer that comprises a copolymer component A having a functional group having the ability to initiate polymerization in an amount of 1-40% by mole and a copolymer component B having a cross-linking group in an amount of 20-70% by mole, wherein the copolymer is fixed by a cross-linking reaction to form the polymerization initiation layer;

pattern-wise forming a graft polymer region on a surface of the polymerization initiation layer, wherein the graft polymer region has the ability to contain a metal ion or a metal salt;

adding a metal ion or a metal salt to the graft polymer region; and

thereafter reducing the metal ion or a metal ion in the metal salt to form a metal particle dispersion region.

2. A method of forming a metal particle pattern of claim 1 , wherein the copolymer comprises the copolymer component A having a functional group having the ability to initiate polymerization in an amount of 5-30% by mole and the copolymer component B having a cross-linking group in an amount of 30-60% by mole.

3. A method of forming a metal particle pattern, comprising:

forming a polymerization initiation layer on a support, the polymerization initiation layer comprising a copolymer that comprises a copolymer component A having a functional group having the ability to initiate polymerization in an amount of 1-40% by mole and a copolymer component B having a cross-linking group in an amount of 20-70% by mole, wherein the copolymer is fixed by a cross-linking reaction to form the polymerization initiation layer;

forming, on a surface of the polymerization initiation layer, a graft polymer layer whose hydrophilicity or hydrophobicity can be changed by heat, acid or radiation of light;

applying heat, acid or radiation of light to the graft polymer layer to form a pattern comprising a hydrophilic region and a hydrophobic region;

adding a metal ion or a metal salt to the hydrophilic region or the hydrophobic region; and

thereafter reducing the metal ion or a metal ion in the metal salt to form a metal particle dispersion region.

4. A method of forming a metal particle pattern of claim 3 , wherein the graft polymer layer comprises a polymer compound having a functional group whose hydrophilicity or hydrophobicity can be changed by application of heat or acid.

5. A method of forming a metal particle pattern of claim 3 , wherein the graft polymer layer comprises a polymer compound having a functional group whose hydrophilicity or hydrophobicity can be changed by application of radiation of light.

6. A method of forming a metal particle pattern, comprising:

forming a polymerization initiation layer on a support, the polymerization initiation layer comprising a copolymer that comprises a copolymer component A having a functional group having the ability to initiate polymerization in an amount of 1-40% by mole and a copolymer component B having a cross-linking group in an amount of 20-70% by mole, wherein the copolymer is fixed by a cross-linking reaction to form the polymerization initiation layer;

pattern-wise forming a graft polymer layer on a surface of the polymerization initiation layer;

adding a metal ion or a metal salt to the graft polymer layer; and

thereafter reducing the metal ion or a metal ion in the metal salt to form a metal particle dispersion region.

7. A method of forming a metal particle pattern of claim 6 , wherein the graft polymer layer is formed by a process including bringing a polymerizable compound having a hydrophilic group into contact with the surface of the polymerization initiation layer and pattern-wise applying light or heat.

8. A method of forming a metal particle pattern of claim 6 , wherein the graft polymer layer is formed by a process including bringing a polymerizable compound having a metal salt structure into contact with the surface of the polymerization initiation layer and pattern-wise applying light or heat.

9. A method of forming a metal particle pattern of claim 6 , wherein the graft polymer layer is formed by a process including bringing a polymerizable compound having affinity for a metal salt into contact with the surface of the polymerization initiation layer and pattern-wise applying light or heat.

10. A method of forming an electroconductive pattern, comprising:

forming a polymerization initiation layer on a support, the polymerization initiation layer comprising a copolymer that comprises a copolymer component A having a functional group having the ability to initiate polymerization in an amount of 1-40% by mole and a copolymer component B having a cross-linking group in an amount of 20-70% by mole, wherein the copolymer is fixed by a cross-linking reaction to form the polymerization initiation layer;

pattern-wise forming a graft polymer region on a surface of the polymerization initiation layer, wherein the graft polymer region has the ability to contain a metal ion or a metal salt;

adding a metal ion or a metal salt to the graft polymer region; and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal particle dispersion region; and

heating, to a temperature of 100° C. to 400° C., a patterned material that forms the metal particle dispersion region.

11. A method of forming an electroconductive pattern of claim 10 , wherein the temperature of the heating is from 150° C. to 400° C.

12. A method of forming an electroconductive pattern of claim 10 , wherein the heating is performed for 30 to 60 minutes.

13. A method of forming an electroconductive pattern, comprising:

forming a polymerization initiation layer on a support, the polymerization initiation layer comprising a copolymer that comprises a copolymer component A having a functional group having the ability to initiate polymerization in an amount of 1-40% by mole and a copolymer component B having a cross-linking group in an amount of 20-70% by mole, wherein the copolymer is fixed by a cross-linking reaction to form the polymerization initiation layer;

forming, on a surface of the polymerization initiation layer, a graft polymer layer whose hydrophilicity or hydrophobicity can be changed by heat, acid or radiation of light;

applying heat, acid or radiation of light to the graft polymer layer to form a pattern comprising a hydrophilic region and a hydrophobic region;

adding a metal ion or a metal salt to the hydrophilic region or the hydrophobic region; and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal particle dispersion region; and

heating, to a temperature of 100° C. to 400° C., a patterned material that forms the metal particle dispersion region.

14. A method of forming an electroconductive pattern of claim 13 , wherein the temperature of the heating is from 150° C. to 400° C.

15. A method of forming an electroconductive pattern of claim 13 , wherein the heating is performed for 30 to 60 minutes.

16. A method of forming an electroconductive pattern of claim 13 , wherein the graft polymer layer comprises a polymer compound having a functional group whose hydrophilicity or hydrophobicity can be changed by application of heat or acid.

17. A method of forming an electroconductive pattern of claim 13 , wherein the graft polymer layer comprises a polymer compound having a functional group whose hydrophilicity or hydrophobicity can be changed by application of radiation of light.

18. A method of forming an electroconductive pattern, comprising:

forming a polymerization initiation layer on a support, the polymerization initiation layer comprising a copolymer that comprises a copolymer component A having a functional group having the ability to initiate polymerization in an amount of 1-40% by mole and a copolymer component B having a cross-linking group in an amount of 20-70% by mole, wherein the copolymer is fixed by a cross-linking reaction to form the polymerization initiation layer;

pattern-wise forming a graft polymer layer on a surface of the polymerization initiation layer;

adding a metal ion or a metal salt to the graft polymer layer; and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal particle dispersion region; and

heating, to a temperature of 100° C. to 400° C., a patterned material that forms the metal particle dispersion region.

19. A method of forming an electroconductive pattern of claim 18 , wherein the temperature of the heating is from 150° C. to 400° C.

20. A method of forming an electroconductive pattern of claim 18 , wherein the heating is performed for 30 to 60 minutes.

21. A method of forming an electroconductive pattern of claim 18 , wherein the graft polymer layer is formed by a process including bringing a polymerizable compound having a hydrophilic group into contact with the surface of the polymerization initiation layer and pattern-wise applying light or heat.

22. A method of forming an electroconductive pattern of claim 18 , wherein the graft polymer layer is formed by a process including bringing a polymerizable compound having a metal salt structure into contact with the surface of the polymerization initiation layer and pattern-wise applying light or heat.

23. A method of forming an electroconductive pattern of claim 18 , wherein the graft polymer layer is formed by a process including bringing a polymerizable compound having affinity for a metal salt into contact with the surface of the polymerization initiation layer and pattern-wise applying light or heat.