IP Library Granted Patent US 6,994,420
Granted Patent B2
US 6,994,420 · App. 10/923,052 · Granted Feb 7, 2006

Print assembly for a wide format pagewidth inkjet printer, having a plurality of printhead chips

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Quick Facts
Patent No.
US 6,994,420
App. No.
10/923,052
Granted
Feb 7, 2006
Kind
B2
Abstract

A print assembly for a wide format pagewidth inkjet printer, the assembly comprising: an elongate carrier that is mountable on a support structure of the printer; a plurality of printhead chips mounted on the carrier to define a printing zone adjacent the carrier, the printhead chips being provided in a number and configuration such that the printing zone has a length of at least 36 inches (914 mm), each printhead chip being of the type that incorporates a plurality of nozzle arrangements, each nozzle arrangement being in the form of a micro electromechanical system to achieve the ejection of ink from the nozzle arrangement; and control circuitry that is positioned on the carrier and is operatively connected to the printhead chips to control operation thereof.

Claims (14)

1. A print assembly for a wide format pagewidth inkjet printer, the assembly comprising:

an elongate carrier that is mountable on a support structure of the printer;

a plurality of printhead chips mounted on the carrier to define a printing zone adjacent the carrier, the printhead chips being provided in a number and configuration such that the printing zone has a length of at least 36 inches (914 mm), each printhead chip being of the type that incorporates a plurality of nozzle arrangements, each nozzle arrangement being in the form of a micro electromechanical system to achieve the ejection of ink from the nozzle arrangement; and

control circuitry that is positioned on the carrier and is operatively connected to the printhead chips to control operation thereof.

2. A print assembly as claimed in claim 1 , in which each printhead chip is the product of an integrated circuit fabrication technique carried out on a silicon wafer substrate that incorporates CMOS drive circuitry for each nozzle arrangement.

3. A print assembly as claimed in claim 2 , in which the printhead chips together incorporate at least fifty thousand nozzle arrangements.

4. A print assembly as claimed in claim 3 , in which the printhead chips together incorporate at least one hundred thousand nozzle arrangements.

5. A print assembly as claimed in claim 4 , in which the printhead chips together incorporate at least two hundred thousand nozzle arrangements.

6. A print assembly as claimed in claim 5 , in which the printhead chips together incorporate between three hundred thousand and eight hundred thousand nozzle arrangements.

7. A print assembly as claimed in claim 5 , in which between forty and one hundred printhead chips are mounted in the carrier.

8. A print assembly as claimed in claim 7 , in which the printhead chips are each positioned at a common angle of greater than zero degrees and less than ninety degrees with respect to a straight line extending at right angles to a feed direction, with consecutive ends of the printhead chips overlapping to ensure continuous printing in the printing zone.

9. A print assembly as claimed in claim 7 , in which the carrier includes a plurality of modules, one printhead chip being incorporated into each module, and the modules being detachably mounted on the carrier to facilitate replacement of the modules, if necessary.

10. A print assembly as claimed in claim 7 , in which an ink reservoir assembly is also mounted on the carrier to be in fluid communication with the printhead chips, the ink reservoir assembly being configured to supply the printhead chip with at least three inks of different colors.

11. A print assembly as claimed in claim 2 , which includes at least one flexible printed circuit board that is interconnected between the control circuitry and the CMOS layer of each printhead chip so that communication can take place between the control circuitry and the CMOS layers.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028542/0543 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2004
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY. LTD.
Reel/Frame 015723/0945 →