Discharge-enhanced atmospheric pressure chemical vapor deposition
A discharge-enhanced CVD apparatus and method utilizes a nozzle containing electrodes to generate a high voltage electrical discharge at or near atmospheric pressure in the absence of a stabilizing or arc-suppressing noble gas. Reactants are passed directly through or/and under the discharge before being directed to the surface of a substrate to be coated.
1 . A method for surface treating or coating a substrate comprising the steps of:
a) positioning an electrode assembly above a substrate;
b) generating a high voltage discharge;
c) passing reactants and carrier gas through and/or under the electrical discharge to the substrate, resulting in modification of the substrate surface.
2 . The method of claim 1 , wherein the process is free of noble gas.
3 . The method of claim 1 , wherein the high voltage discharge has a linear geometry of variable length.
4 . The method of claim 1 , wherein the modification of the substrate surface comprises a discharge enhanced chemical vapor deposition (DECVD) resulting in the application of a coating to the substrate.
5 . The method of claim 1 , wherein the process occurs at or near atmospheric pressure.
6 . The method of claim 1 , wherein the substrate comprises glass, borosilicate, or a plastic.
7 . The method of claim 1 , wherein the temperature of the substrate surface is less than 700° C.
8 . The method of claim 7 , wherein the surface temperature of the surface is less than 200° C.
9 . The method of claim 7 , wherein the coating is a hard coating selected from the group consisting of boride, carbide, nitride, oxide, and mixtures thereof, and the surface is at from 400 to 700° C.
10 . The method of claim 1 , wherein the carrier gas is selected from the group consisting of N 2 , NH 3 , H 2 , air, O 2 , NO 2 , N 2 O and mixtures thereof.
11 . The method of claim 1 , wherein the substrate is at an elevated temperature,
resulting in an annealed, crystalline coating.
12 . The method of claim 1 further comprising the step of heating the surface
modified substrate, resulting in an annealed, crystalline coating.
13 . A nozzle for discharge-enhanced chemical vapor deposition utilizing glow and corona discharges, comprising:
an inlet arranged to receive a carrier gas and vaporized reactants;
at least two electrodes between which the carrier gas and vaporized reactants pass, said electrodes being connected to an electrical power source to cause a discharge to form between said electrodes and thereby energize said reactants;
an outlet arranged to direct said energized reactants to a substrate,
wherein said discharge is a high voltage discharge generated in the absence of a stabilizing or arc-suppressing gas.
14 . A nozzle as claimed in claim 13 , wherein at least one of said electrodes is covered with a dielectric material, and said discharge is a dielectric barrier discharge.
15 . A nozzle as claimed in claim 13 , wherein at least two of said electrodes are covered with a dielectric material.
16 . A nozzle as claimed in claim 13 , wherein said discharge is a corona (glow) discharge.
17 . A nozzle as claimed in claim 13 , wherein said electrodes are plate electrodes.
18 . A nozzle as claimed in claim 13 , further comprising exhaust passages adjacent to an outside of said electrodes, said exhaust passages being arranged to exhaust reaction products.
19 . A nozzle as claimed in claim 13 , wherein said electrodes are cylindrical rods.
20 . A nozzle as claimed in claim 13 , wherein at least one of said electrodes is covered with a dielectric material and said discharge is a dielectric barrier discharge.
21 . A nozzle as claimed in claim 13 , wherein said nozzle is stationary and said substrate is moved relative to said nozzle.
22 . Apparatus for discharge-enhanced chemical vapor deposition utilizing arc discharges, comprising:
at least two electrodes between which a carrier gas and vaporized reactants pass, said two electrodes being positioned on a same side of a substrate; and
a high voltage power source arranged to cause a discharge to form between said electrodes and thereby energize said reactants;
wherein said discharge is a high voltage discharge generated in the absence of a stabilizing or arc-suppressing gas.
23 . Apparatus as claimed in claim 22 , wherein at least one of said electrodes is covered with a dielectric material, and said discharge is a dielectric barrier discharge.
24 . Apparatus as claimed in claim 22 , wherein at least two of said electrodes are covered with a dielectric material.
25 . Apparatus as claimed in claim 22 , wherein said discharge is a corona discharge.
26 . A method of coating or surface treating a substrate, comprising the steps of:
positioning at least two electrodes above a substrate;
generating a high voltage discharge between the electrodes in the absence of a stabilizing or arc-suppressing gas;
passing a carrier gas and reactants between the electrodes in order to energize the reactants and cause them to react with the substrate and form a coating thereon.