Millimeter wave (MMW) radio frequency transceiver module and method of forming same
View Patent ↗A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.
1. A millimeter wave transceiver module comprising:
a single thick-film substrate board comprising a plurality of thick film layers;
one or more MMIC chips connected to the substrate board and operable to transmit and receive millimeter wavelength RF signals; and
a plurality of RF filters formed on the substrate board and operative with the MMIC chips.
2. A millimeter wave transceiver module according to claim 1 , wherein said MMIC chips are connected directly to the substrate board.
3. A millimeter wave transceiver module according to claim wherein the transceiver module includes a receiver, local oscillator and transmitter, each respectively comprising one or more of said MMIC chips.
4. A millimeter wave transceiver module according to claim 3 , wherein said MMIC chops are spatially arranged in a receiver section, a local oscillator section and a transmitter section.
5. A millimeter wave transceiver module according to claim 1 , wherein the substrate board comprises a ceramic material.
6. A millimeter wave transceiver module according to claim 1 , said substrate board includes a top surface and further comprising high frequency capacitors embedded on the top surface of the substrate board.
7. A millimeter wave transceiver module according to claim 1 , and further comprising a connector system mounted on the board and adapted for connecting another board with the substrate board and comprising a housing member having a circuit board engaging surface mounted on the substrate board and clip receiving slot and an electrically conductive clip member received within clip receiving slot.
8. A millimeter wave transceiver module according to claim 1 , wherein said layers of said substrate board comprise separately cured layers.
9. A millimeter wave transceiver module according to claim 1 , and further comprising ground vias formed within the substrate board for isolating any transmitted and received millimeter wavelength signals.
10. A millimeter wave transceiver module comprising:
a single thick-film substrate board comprising a plurality of thick film layers;
one or more MMIC chips connected to the substrate board and operable to transmit and receive millimeter wavelength RF signals; and
a microstrip-to-waveguide transition formed in the substrate board and operable with one or more MMIC chips to transmit or receive millimeter wavelength signals.
11. A millimeter wave transceiver module according to claim 10 , wherein said MMIC chips are connected directly to the substrate board.
12. A millimeter wave transceiver module according to claim 10 , wherein the transceiver module includes a receiver, local oscillator and transmitter, each respectively comprising one or more of said MMIC chips.
13. A millimeter wave transceiver module according to claim 12 , wherein said MMIC chops are spatially arranged in a receiver section, a local oscillator section and a transmitter section.
14. A millimeter wave transceiver module according to claim 10 , wherein the substrate board comprises a ceramic material.
15. A millimeter wave transceiver module according to claim 10 , wherein said substrate board includes a top surface and further comprising high frequency capacitors embedded on the top surface of the substrate board.
16. A millimeter wave transceiver module according to claim 10 , wherein and further comprising a connector system mounted on the board and adapted for connecting another board with the substrate board and comprising a housing member having a circuit board engaging surface mounted on the substrate board and clip receiving slot and an electrically conductive clip member received within clip receiving slot.
17. A millimeter wave transceiver module according to claim 10 , wherein said layers of said substrate board comprise separately cured layers.
18. A millimeter wave transceiver module according to claim 10 , and further comprising ground vias formed within the substrate board for isolating any transmitted and received millimeter wavelength signals.
19. A millimeter wave transceiver module according to claim 10 , wherein said microstrip-to-waveguide transition comprises a backshort formed relative to the substrate board and a waveguide launch operative with the backshort, and a plurality of isolation vias.