Resin composition and process for preparing multi-layer structure using the same
View Patent ↗The present invention provides a resin composition that is added when a multi-layer structure containing hydrolyzed ethylene-vinyl acetate copolymer is reground into a multi-layer structure and a process for preparing a multi-layer structure using the resin composition. Specifically, the present invention relates to a resin composition comprising (A) polyolefin, (B) metal salt of higher fatty acid having 12 to 30 carbon atoms and (C) zeolite. Also, the multi-layer structure is prepared by the process of regrinding by adding the resin composition to a multi-layer structure containing hydrolyzed ethylene-vinyl acetate copolymer.
1. A resin composition for molding, comprising
(A) polyolefin,
(B) metal salt of higher fatty acid having 12 to 30 carbon atoms,
(C) zeolite, and
a chip or remolded pellet of a collected multi-layer structure containing a hydrolyzed ethylene-vinyl acetate copolymer.
2. The resin composition of claim 1 , further comprising (D) hydrolyzed ethylene-vinyl acetate copolymer, wherein in the (D) hydrolyzed ethylene-vinyl acetate copolymer the ethylene content is 70 to 95% by mol and the hydrolysis degree of the vinyl acetate component is at least 85% by mol.
3. The resin composition of claim 1 , wherein the content of (C) zeolite is at least 5% by weight and less than 50% by weight.
4. The resin composition of claim 2 , wherein the weight ratio of (A) polyolefin and (D) hydrolyzed ethylene-vinyl acetate copolymer is 95 to 30:5 to 70.