IP Library Granted Patent US 7,134,796
Granted Patent B2
US 7,134,796 · App. 10/925,901 · Granted Nov 14, 2006

XFP adapter module

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Quick Facts
Patent No.
US 7,134,796
App. No.
10/925,901
Granted
Nov 14, 2006
Kind
B2
Abstract

A device which in an optical interface adapts XFP to a 300 pin MSA transponder socket, permitting replacement of 300 pin MSA transponders with an XFP module on an existing host circuit pack. The device performs dispersion compensation in a removable module, addressing issues of jitter, path length equalization, cross talk and electromagnetic compatibility. As deployed, the device presents at the optical interface the attributes of XFP, hence connected optical devices are “fooled” into reading a connection to XFP instead of the 300 pin MSA.

Claims (7)

1. A system comprising a removable dispersion compensation device for use in an optical interface comprising a 300 pin connector, microprocessor, SERDES/CDR chip and an XFP assembly, the removable dispersion compensation device comprising a laser, a photodetector, and means for performing clock recovery, multiplexing, and demultiplexing, said system further comprising a system card to which said dispersion compensation device is connected, said system card having low speed parallel circuitry and said dispersion compensation device having high speed serial circuitry.

2. The device according to claim 1 further comprising a fiber jumper pair.

3. The device according to claim 1 further comprising a case heat sink.

4. The device according to claim 1 further comprising an EMI shield.

5. The device according to claim 1 adapted to be deployed in a 300 pin MSA transponder socket.

6. A method of converting an optical interface device comprising a 300 pin MSA transponder to an optical interface device comprising an XFP transponder comprising removing said 300 pin MSA transponder from a 300 pin MSA socket and inserting in said socket a device comprising a 300 pin connector, microprocessor, SERDES/CDR chip and an XFP assembly wherein the method further comprises implementing high speed serial circuitry on a separate module from low speed parallel circuitry.

7. A method of presenting at an optical interface connection of an existing 300 pin MSA host circuit pack the attributes of XFP, thereby deceiving optical devices connected thereto into reading a connection to XFP instead of the 300 pin MSA, comprising removing from a 300 pin MSA socket in said host circuit pack a 300 pin MSA transponder, inserting into said 300 pin MSA socket a device comprising a 300 pin connector, microprocessor, SERDES/CDR chip and an XFP assembly and connecting said device to existing fiber management of said host circuit pack, wherein said method further comprises implementing functionality to reduce jitter, and to equalize path length differences for signals on said device.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Dec 13, 2019
From: DEUTSCHE AG NEW YORK BRANCH
To: OCLARO FIBER OPTICS, INC.; LUMENTUM OPERATIONS LLC; OCLARO, INC.
Reel/Frame 051287/0556 →
CHANGE OF NAME Recorded Jul 24, 2019
From: OCLARO FIBER OPTICS, INC.
To: LUMENTUM FIBER OPTICS INC.
Reel/Frame 049843/0453 →
PATENT SECURITY AGREEMENT Recorded Dec 11, 2018
From: LUMENTUM OPERATIONS LLC; OCLARO FIBER OPTICS, INC.; OCLARO, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047788/0511 →
CHANGE OF NAME Recorded Jun 22, 2018
From: OPNEXT, INC.
To: OCLARO FIBER OPTICS, INC.
Reel/Frame 046416/0022 →